Product overview
This series is dedicated planarization equipment for 6-8-inch wafers. HP 200 is an exclusive model for 8-inch wafers, and HP300/HP400 are 6/8-inch compatible models. All three models integrate a polishing, cleaning and EFEM integrated architecture, and are equipped with a high-precision advanced process control system, covering the full scenarios from basic material polishing to the special planarization of third-generation semiconductors and advanced packaging. The cumulative volume of qualified processed wafers exceeds 400 million pieces.
Advantages
General Core Advantages
1. Adopts a "Dry in and dry out" dry-type integrated process architecture to improve processing efficiency and reduce the risk of wafer contamination.
2. Equipped with eddy current/laser/motor torque triple endpoint control, and PTPC and PPC systems to achieve nanoscale polishing precision.
3. Realizes localized full-chain adaptation, fully replacing imported equipment, with supply chain and service response more in line with the domestic market demand.
4. Compatible with various polishing pads and slurries, and can quickly adjust process parameters to adapt to the polishing needs of multiple materials and links.
Model-Specific Advantages
HP 200: Adopts a classic 4-polishing head + 3-platen architecture, specially designed for 8-inch wafer mass production, and meets the complex planarization processes of the entire IC manufacturing flow.
HP 300: The integrated controller design greatly reduces the floor space, supports precise platen temperature control (<60℃), and adapts to the polishing needs of high-temperature sensitive third-generation semiconductors.
HP 400: Equipped with a platen cooling water system and an automatic wafer transfer module, with WIW&WTW < 5%. CLC flow control makes process parameter adjustment more precise, and the equipment has a higher degree of automation.
Applications
1. Integrated circuit manufacturing: Meets the process requirements of STI, ILD, metal wiring and other processes in IC manufacturing, and is suitable for the polishing of mainstream materials such as oxides, silicon, copper and tungsten.
2. Third-generation semiconductor processing: HP300/HP400 are adapted to the special planarization processing needs of materials such as SiC and GaN.
3. Advanced packaging process: The full series supports the planarization of advanced packaging materials such as 2.5D/3D interposers and polymers.
4. Large-scale wafer processing: Can implement mainstream polishing processes such as Oxide, Cu, W, STI&Poly Silicon, and adapt to large-scale wafer mass production lines.
Parameters
|
Specifications |
HP 200 (8-inch exclusive) |
HP 300 (6/8-inch compatible) |
HP 400 (6/8-inch compatible) |
|
Adapted wafer size |
8-inch (200mm) |
6/8-inch (150/200mm) |
6/8-inch (150/200mm) |
|
Core architecture |
4 polishing heads + 3 platens; Polisher+Cleaner+EFEM integrated architecture |
4 polishing heads + 3 platens; Polisher+Cleaner+EFEM integrated architecture; integrated controller |
4membrane polishing heads; 3 platens (with cooling water system); 270° HS rotation; max. 4slurry lines |
|
Core process design |
"Dry in and dry out" CMP |
"Dry in and dry out" CMP; platen temperature monitoring (<60℃) |
Wafer auto-flipping (WR); equipped with automatic wafer transfer module; CLC flow control |
|
Uniformity index |
- |
- |
WIW&WTW < 5% |
|
Advanced process control |
Eddy current/laser/motor torque endpoint control; PTPC dynamic control; PPC integrated metrology system |
Eddy current/laser/motor torque endpoint control; PTPC dynamic control; PPC integrated metrology system |
I-scan/laser/motor torque endpoint control; CLC flow control |
|
Key functions |
Supports planarization of advanced packaging polymers |
Adapted to third-generation semiconductor materials such as SiC and GaN; compatible with various polishing pads and slurries |
Precise multi-channel slurry distribution; real-time platen temperature monitoring; automatic wafer transfer and flipping |
|
Processing process coverage |
Full processes such as Oxide, Cu, W, STI&Poly Silicon |
Oxide, Cu, W, STI&Poly Silicon; special processes for third-generation semiconductor materials |
Oxide, Cu, W; characteristic processes for advanced packaging/third-generation semiconductors |
FAQ
Q: What wafer sizes do the three CMP models support?
A: HP 200 is for 8-inch (200mm) wafers only; HP 300/HP 400 are compatible with 6/8-inch (150/200mm) wafers.
Q: What are the core application fields?
A: Integrated circuit manufacturing, third-generation semiconductor (SiC/GaN) processing and advanced packaging processes.
Q: What is the key process control capability of the series?
A: All models feature eddy current/laser/motor torque triple endpoint control, with nanoscale polishing precision via PTPC/PPC systems.
Q: What are the standout advantages of each model?
A: HP 200: Classic 4-head+3-platen for 8-inch mass production;
HP 300: Compact design with platen temp control (<60℃);
HP 400: WIW&WTW<5% with high automation (auto wafer transfer/flip).
Q: Can this series replace imported CMP equipment?
A: Yes, it achieves localized full-chain adaptation and fully replaces imported 8-inch CMP equipment with industry-leading performance and yield.
Hot Tags: 8-inch cmp equipment, China 8-inch cmp equipment manufacturers, suppliers
