Product overview
MHS 100, developed by Leuven Instruments, is a dedicated metal hardmask etching system for 12-inch IC industry. It consists of ICP etch chambers and a transfer module, focusing on TiN metal hardmask opening in back-end copper interconnect processes (high repeat frequency). It can work independently for hardmask etching of different tech nodes and also serve as an optional module for MSE 100 to realize integrated etching from metal hardmask to device functional layer
Advantages
Mass Production Adaptability
Designed for 12-inch IC wafer mass production, with verified stability to meet high-repeat hardmask etching needs .
Wide Process Compatibility
Supports TiN hardmask etching and SADP process for 55nm and advanced tech nodes .
Good Integration Expandability
Flexible combination with LMEC-300™ for "hardmask-functional layer" integrated etching, improving efficiency
Application
Back-end processes of 12-inch IC
Core application in TiN metal hardmask opening of back-end copper interconnects .
Advanced tech node manufacturing
Suitable for IC production of 55nm and more advanced tech nodes .
Emerging memory device fabrication
Provides integrated etching solutions when combined with LMEC-300™ .
Parameters
|
Category |
Details |
|
Wafer Compatibility |
Dedicated for 12-inch (300mm) IC wafers, matching mass production line size requirements |
|
Chamber Configuration |
Equipped with inductively coupled plasma (ICP) etch chambers + transfer module, ensuring stable process and wafer transfer |
|
Target Materials & Processes |
Focus on TiN metal hardmask etching; compatible with SADP processes |
|
Compatible Technology Nodes |
Supports 55nm and advanced technology nodes, meeting high-end IC manufacturing precision needs |
|
Integration Capability |
Optional module for LMEC-300™, enabling "hardmask-functional layer" integrated etching |
|
Industrial Compliance |
Adopts semiconductor mass production-standard components and design concepts, suitable for 12-inch IC volume production |
FAQ
Q: What wafer size does it support?
A: Dedicated for 12-inch (300mm) IC wafers.
Q: What's its core application?
A: TiN metal hardmask opening in 12-inch IC back-end copper interconnects.
Q: Which tech nodes is it compatible with?
A: 55nm and more advanced technology nodes.
Q: Can it integrate with other systems?
A: Yes, it's an optional module for LMEC-300™ for integrated etching.
Q: Does it support SADP processes?
A: Yes, compatible with self-aligned double patterning (SADP) processes.
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