Your Professional Lithography Machine Supplier
Nice-tech is a professional semiconductor equipment provider with a dedicated factory and an experienced technical team. Our operations are supported by multiple production lines equipped with standardized process control and key semiconductor-related equipment to ensure stable quality and delivery. The company is backed by a skilled team of engineers, technicians, and project specialists with solid industry experience, enabling effective coordination between equipment suppliers and end users.
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Maskless Lithography MachineThis maskless lithography machine, simply put, is a machine that can etch intricate patterns onto materials without a "mask." It's more flexible and cost-effective than traditional stencil lithography, and allows for rapid pattern...view more -
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why choose us
Tailored Solution Delivery
Our experienced team analyzes clients' specific needs to match the most suitable semiconductor equipment and offer customized solutions for different production and R&D scenarios.
Comprehensive Technical Support
We provide full-cycle technical assistance, from equipment commissioning to maintenance, including on-site troubleshooting and real-time online consultation, reducing operational hassles.
Support for Advanced Processes
We continuously invest in industry insights and adapt to cutting-edge tech trends, offering high-precision equipment solutions and upgrading services to meet high-end chip production needs.
Service Advantages
Offer 1v1 online support for equipment operation, parameter adjustment, and process optimization, responding to your questions promptly.
Maskless lithography machines are tools that directly write patterns onto substrates without needing masks. They use focused beams—like electron, laser, or ion beams—to etch or deposit materials with high precision. This technology is especially useful for creating microchips, sensors, and biomedical devices. Because it eliminates the mask-making step, it speeds up production and reduces costs, making it ideal for small runs and rapid prototyping. The systems vary in complexity, from desktop units for research labs to large industrial setups. As the technology matures, it offers higher resolution, faster processing speeds, and greater flexibility, positioning itself as a key enabler in advanced manufacturing.
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Model |
MLM 100 |
MLM 200 |
MLM 300 |
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Critical dimension |
0.8 μm |
0.4 μm |
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Minimum lines and spaces |
1.0 μm |
0.8 μm |
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Exposure speed |
Lens①:3 mm2 /min Lens②:20 mm2 /min Lens③:100 mm2 /min |
Lens①:1 mm2 /min Lens②:3 mm2 /min Lens③:20 mm2 /min Lens④:100 mm2 /min |
Lens①:10 mm2 /min Lens②:60 mm2 /min Lens③:150 mm2 /min |
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Overlay accuracy (5 mm × 5 mm) |
400 nm |
350 nm |
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Overlay accuracy (50 mm × 50 mm) |
1000 nm |
700 nm |
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Wavelength |
LED:405 nm / 380 nm |
LED:405 nm / 390 nm |
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Automated lens switching |
Supported |
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Grayscale |
Optional |
Supported |
Non-optional |
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Substratesize |
3 mm × 3 mm(min) & 150 mm × 150 mm(max) |
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Substrate thickness |
0-10 mm |
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Data format |
GDS & DWG & DXF |
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Dimensions (L×W×H) |
750 mm × 800 mm × 700 mm |
1150 mm × 950 mm × 2000 mm |
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Weight |
320 kg |
590 kg |
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Installation requirements |
Total area:1.5 m × 1.5 m Power:1.3 Kw; Temperature:20–30 ℃; Humidity:RH 40-60 % Power supply:220 V ±5 %, 50 Hz ±1 Hz, 10 A |
Total area:2.2 m × 1.7 m Power:1.4 Kw; Temperature:20–30 ℃; Humidity:RH 40-60 % Power supply:220 V ±5 %, 50 Hz ±1 Hz, 10 A |
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Advantages of Maskless Lithography Machine
Enhanced Precision
One of the most significant advantages of maskless lithography is its extreme precision. The technology can achieve resolutions well below 10 nanometers, making it ideal for producing intricate designs required in modern electronics.
Cost Efficiency
Traditional lithography requires expensive photomasks, which can be costly to produce and maintain. Maskless lithography eliminates this need, thus significantly reducing manufacturing costs, especially for low-volume production runs.
Flexibility in Design
Maskless lithography allows for rapid design changes without the need for new masks. This flexibility makes it particularly advantageous for research and development purposes, as well as in industries where designs frequently evolve.
Speed of Production
While the initial setup for maskless lithography machines can be time-consuming, the ability to bypass mask production can lead to faster turnaround times for new designs.
Compatibility with Various Materials
This technology can work with a wide range of materials, including those that may not be compatible with traditional photolithography processes.
Electron-Beam Lithography (EBL)
Electron-beam lithography utilizes a focused electron beam to create patterns on resist-coated surfaces. Known for its atomic-level resolution, this method is essential in semiconductor manufacturing and nanostructure fabrication.
X-ray Lithography
Using high-energy X-rays to penetrate thick resists, X-ray lithography produces exceptionally deep and fine patterns. This technique is advantageous for creating micro- and nanoscale structures in materials that require greater resist thickness, such as in MEMS or integrated optical devices.
Laser Lithography
In laser lithography, a focused laser beam transfers patterns onto a substrate. This technique stands out for its rapid processing, particularly in large-area applications.
Nanoimprint Lithography (NIL)
Nanoimprint Lithography molds to create nanometer-scale patterns. Its high volume with low-cost prospects favor applications such as solar cells or polymer-based electronic devices immensely.
Direct Write Lithography
Direct write lithography employs various tools, such as atomic force microscopy (AFM) or scanning probe microscopy (SPM). It is employed to deposit materials directly onto substrates.
Applications of Maskless Lithography Machine
Semiconductor Prototyping and Small-Scale Production
Maskless lithography accelerates the development of new chip designs by enabling rapid prototyping. Companies like Intel and TSMC are exploring its use for creating test wafers and small batches of custom chips.
Biomedical Device Fabrication
In healthcare, maskless lithography is used to produce microfluidic devices, biosensors, and implantable electronics. Its precision allows for complex, multi-layered structures essential for advanced diagnostics.
Micro-Optics and Photonics Components
Manufacturers of lenses, waveguides, and laser components utilize maskless systems for custom, high-precision micro-optics. These components are vital in telecommunications, laser systems, and augmented reality devices.
Aerospace and Defense Components
In aerospace, maskless lithography is used to create lightweight, high-strength micro-structures for satellites and drones. Its flexibility allows for on-demand manufacturing of specialized parts, reducing inventory needs.
Advanced Research and Development
Research institutions employ maskless lithography for exploring new materials and device architectures. Its versatility supports experimental setups that require rapid iteration.
How It Works Maskless Lithography Machine
Design Preparation: Engineers create a digital pattern using CAD software. This pattern is then converted into a format compatible with the lithography system.
System Calibration: The machine calibrates its components to ensure precise alignment and focus. This step is crucial for achieving high-resolution features.
Substrate Loading: The substrate, typically a silicon wafer or glass panel, is loaded into the machine’s stage.
Patterning Process: Using a focused electron, laser, or ion beam, the machine writes the pattern directly onto the substrate. It scans across the surface, exposing or etching specific areas based on the digital design.
Development or Etching: Post-exposure, the substrate undergoes chemical development or etching to reveal the patterned features.
Inspection & Quality Control: The finished product is inspected for accuracy and resolution, ensuring it meets specifications.
Maintenance and Calibration
Maintenance
The quality of the patterns directly relates to the system’s maintenance. Upkeep entails routinely replacing worn components, such as electron-emitter filaments in EBL systems or laser diodes in laser lithography. Additionally, cleaning resist-coat/ developer stations between uses minimizes contamination, which affects resist application and pattern transfer.
Calibration
Frequent calibrating of a maskless lithography system becomes indispensable to maintain its accuracy. For instance, in electron-beam lithography, the electron-optical system needs regular calibration to ensure the beam maintains its focus and the exposure area remains consistent. With such measures, systems generally use dedicated calibration runs with test patterns before major fabrication sessions to correct potential deviations.
FAQ
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