Your Professional Wet Process Equipment Supplier
Nice-tech is a professional semiconductor equipment provider with a dedicated factory and an experienced technical team. Our operations are supported by multiple production lines equipped with standardized process control and key semiconductor-related equipment to ensure stable quality and delivery. The company is backed by a skilled team of engineers, technicians, and project specialists with solid industry experience, enabling effective coordination between equipment suppliers and end users.
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![Wafer Scrubber]()
Wafer ScrubberThis Wafer Scrubber is a true workhorse—handles 6-inch to 12-inch wafers, and fits right into both wafer fabrication and advanced packaging workflows.view more -
![Wafer Plating Equipment]()
Wafer Plating EquipmentThis wafer plating equipment is purpose-built for 12-inch semiconductor wafers—specifically tailored for dual damascene copper interconnect processes, covering 90nm down to 28nm technology nodes.view more -
![Single Wafer Cleaner]()
Single Wafer CleanerThis single wafer cleaner is built specifically for semiconductor wafer work—covering everything from 8-inch to 12-inch formats, no exceptions. Every model comes with precise process controls (think heating, concentration, flow rate)...view more -
![Photoresist Stripping System]()
Photoresist Stripping SystemThe Photoresist Stripping System is made just for 6–12-inch wafers—ideal for metal lift-off jobs across all sorts of fields. It comes ready to go with a 3-chamber setup (soaking, stripping, cleaning), but if you need more, we can...view more -
![Chemical Dispense System]()
Chemical Dispense SystemThis Chemical Dispense System is a pro-grade solution—fully SEMI-compliant, built specifically for semiconductor and chemical processing setups. It’s made to handle, mix, and dispense all kinds of chemicals: acids, alkalis, organic...view more -
![Batch Wafer Cleaner]()
Batch Wafer CleanerThe Batch Wafer Cleaner—including the 12-inch Models and 8-inch BC Models—was built for precision in semiconductor manufacturing and silicon wafer processing, specializing in wet etching and cleaning. What sets it apart? Format...view more -
![Backside Wafer Cleaner]()
Backside Wafer CleanerThe Backside Wafer Cleaner is a specialized wet processing device designed for semiconductor wafer backside cleaning, supporting 6–12-inch wafer formats. Tailored for advanced packaging workflows, it features a 4-chamber configuration,...view more -
![Advanced Packaging Wafer Plating Equipment]()
Advanced Packaging Wafer Plating EquipmentThis Advanced Packaging Wafer Plating equipment is all about flexibility and speed—it handles 6-inch to 12-inch wafers, and you can pick between 2D or 3D setups (that’s BDS 2D and BDS 3D, respectively). It’s built to fit right into...view more
why choose us
Tailored Solution Delivery
Our experienced team analyzes clients' specific needs to match the most suitable semiconductor equipment and offer customized solutions for different production and R&D scenarios.
Comprehensive Technical Support
We provide full-cycle technical assistance, from equipment commissioning to maintenance, including on-site troubleshooting and real-time online consultation, reducing operational hassles.
Support for Advanced Processes
We continuously invest in industry insights and adapt to cutting-edge tech trends, offering high-precision equipment solutions and upgrading services to meet high-end chip production needs.
Service Advantages
Offer 1v1 online support for equipment operation, parameter adjustment, and process optimization, responding to your questions promptly.
Wafer cleaners are specialized equipment used in the semiconductor fabrication process to remove contaminants, particles, and residues from silicon wafers. These contaminants can include organic residues, metallic particles, and chemical residues that, if left unremoved, can compromise device performance. Wafer cleaning involves a combination of chemical, ultrasonic, and physical processes designed to achieve a pristine surface. The cleaning process must be precise, as wafers are extremely delicate and require non-abrasive techniques to prevent surface damage. The goal is to produce ultra-clean wafers that meet the stringent standards necessary for subsequent manufacturing steps like lithography and doping.
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Specification |
Details |
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Wafer Size |
6-12 inch |
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Load Ports |
2-4 load ports |
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Cleaning Chambers |
4-8 cleaning chambers |
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Key Cleaning Functions |
- Wafer flip function(sequential front/back cleaning) |
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Cleaning Technologies |
Hot DIW(Deionized Water), N2 atomizing two-fluid cleaning |
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Application Fields |
Wafer fabrication, advanced packaging |
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Core Purpose |
Wafer surface/backside/edge particle/residue removal |
High Cleaning Efficacy
Even sub-micron particles, thin organic films, or metallic residues can compromise device functionality and lead to costly defects. Advanced wafer-cleaning machines must be capable of removing a broad spectrum of contaminants—including particulates, photoresist residues, oxides, and ionic impurities—without damaging delicate wafer surfaces.
Process Flexibility
Modern wafer-cleaning systems must support a wide range of cleaning methodologies to accommodate diverse materials and process steps.
Automation and Process Control
Leading-edge wafer cleaners integrate sophisticated automation and real-time process monitoring to ensure repeatability and reduce human error.
High-Purity Materials and Design
To prevent cross-contamination, wafer-cleaning equipment must be constructed from high-purity materials that do not introduce particles or leach contaminants.
Process Efficiency and Sustainability
Efficiency is critical in high-throughput semiconductor fabs. Wafer-cleaning machines should offer short cycle times without compromising cleaning quality. Rapid processing helps sustain high production rates and reduces work-in-progress (WIP) bottlenecks.
Types of Wafer Scrubber
Chemical Cleaning Systems
These are the cornerstone of wafer cleaning in semiconductor fabs, employing a sequence of chemical baths to eliminate organic, inorganic, and biological contaminants. Common processes include RCA cleaning (RCA-1 and RCA-2), which uses mixtures of ammonia, hydrogen peroxide, hydrochloric acid, and deionized water to remove particles, organic films, and metal ions.
Ultrasonic Cleaning Machines
Utilizing high-frequency sound waves (typically 20–40 kHz), ultrasonic cleaners induce cavitation in liquid solutions, creating microscopic bubbles that implode and dislodge sub-micron particles from wafer surfaces. This method is particularly effective for delicate substrates like sapphire wafers used in LEDs and optoelectronics.
High-Purity Water Rinse Systems
After chemical or physical cleaning, wafers must be rinsed with ultrapure water (UPW) to remove residual contaminants. UPW has resistivity up to 18.2 MΩ·cm and is free of ions, particles, and organics. These systems often include megasonic agitation, spin rinsing, and drying (SRD) to ensure complete cleanliness and prevent watermarks.
Dry Cleaning Systems
Dry cleaning technologies eliminate the need for liquid chemicals by using physical or chemical vapor processes. Methods include laser cleaning (using pulsed lasers to ablate particles), cryogenic cleaning (dry ice blasting), and advanced techniques like hydrogen radical cleaning.
Applications of Wafer Scrubber
Semiconductor fabrication:
Ensuring chips are free of particles that could cause defects, leading to higher yields and better performance.
MEMS devices:
Micro-electromechanical systems require ultra-clean wafers to function reliably, especially in sensors and actuators.
LED manufacturing:
Clean wafers prevent light scattering and improve luminous efficiency in LED chips.
Solar panels:
Silicon wafers used in solar cells must be free of contaminants to maximize energy conversion efficiency.
How It Works Wafer Scrubber
Pre-cleaning: The wafer undergoes initial rinsing to remove loose particles and surface residues, often using deionized water or mild chemicals.
Chemical cleaning: Specific cleaning agents are applied to dissolve organic residues, metallic contaminants, and chemical residues. These chemicals are carefully selected to avoid damaging the wafer surface.
Ultrasonic agitation: Ultrasonic waves generate cavitation bubbles that help dislodge stubborn particles from the wafer surface, ensuring thorough cleaning.
Rinsing: The wafer is rinsed with ultrapure water to remove any remaining chemicals and loosened debris, preventing cross-contamination.
Drying: The wafer is dried using spin drying or vapor drying techniques to prevent water spots and particle redeposition.
Inspection: Final inspection ensures the wafer surface meets cleanliness standards before moving to subsequent steps.
Maintenance
Regular Inspection:
Conduct frequent visual and diagnostic checks for signs of wear, corrosion, or leaks in pumps, valves, nozzles, and tubing.
01
Component Replacement:
Proactively replace consumable or worn parts—such as seals, filters, and spray bars—before they fail and cause system downtime.
02
Internal Cleaning:
Periodically clean tanks, recirculation lines, and filtration systems to prevent biofilm buildup, particle accumulation, and chemical residue deposits.
03
Chemical Monitoring:
Continuously monitor and calibrate chemical concentrations (e.g., SC1, SC2, HF solutions) to ensure cleaning efficacy and avoid material damage.
04
Preventive Maintenance Scheduling:
Follow OEM-recommended service intervals and maintain detailed logs to track performance trends and anticipate issues.
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FAQ
As one of the most professional wet process equipment manufacturers and suppliers in China, we're featured by quality products and good price. Please rest assured to buy customized wet process equipment from our factory. For quotation and pricelist, contact us now.
