Product overview
Our company's three Magnetron Sputtering Equipment, based on PVD technology, all deposit high-quality metal, dielectric, and semiconductor films, but differ in application focus.
Take the industrial single-chamber model: it's engineered for large-scale production, with standout target utilization that keeps costs in check. It handles 8-inch wafers seamlessly, delivering the consistent output industrial manufacturing demands.
Then there's the industrial multi-chamber version, which uses modular, independent chambers (think heating, sputtering, and more) to automate the entire coating process.
It's a game-changer for mass-producing complex multi-layer films, cutting down on manual intervention. The research-grade machine, on the other hand, is designed specifically for universities and research institutions. It offers flexible setups-like multi-target sputtering-to accommodate small-batch R&D work, whether for silicon carbide materials or quantum chip prototypes. Across all three, we stick to our "craftsmanship quality" commitment, making sure they meet the varied needs of the semiconductor industry.
To get the best solution for you, please contact us.
Applications
Our company's three Magnetron Sputtering Equipment each have their own niche-together covering every need in the semiconductor industry.
Take the industrial single-chamber model: it's all about large-scale manufacturing, like integrated circuits. For 8-inch wafer thin-film preparation, it's fast and steady, slots right into CMOS/IGBT production lines, and hits both capacity and yield goals without a hitch.
The industrial multi-chamber one stands out with full automation and solid integration. Those tricky complex multi-layer films for 5G and optoelectronic devices? It handles them easily, meeting the tight precision demands of mass production.
Then the research-grade model-this one's tailored for university R&D. It supports small-batch tests on new materials like silicon carbide, and acts as a super flexible verification platform.
Advantages
Our three Magnetron Sputtering Equipment each bring targeted strengths to the table, tailored for distinct application scenarios:
1. Industrial Single-Chamber Model:
It scores big with high target utilization-directly slashing operational costs. When processing 8-inch wafers, it delivers rock-solid performance; film uniformity stays within ±3%, easily hitting industrial yield requirements. Plus, its straightforward structure makes maintenance a breeze.
2. Industrial Multi-Chamber Model:
Modular automated chambers are its ace in the hole, ramping up production efficiency significantly. It also features advanced particle control, which ensures top-tier film purity-perfect for crafting multi-layer films used in 5G and optoelectronic devices. What's more, its strong integration capability lets it adapt to a wide range of materials seamlessly.
3. Research-Grade Model:
Designed with R&D in mind, it offers flexible setups like multi-target sputtering to fit new material development needs. Micrometer-level precision gives reliable support for process verification, and its small-batch processing design helps cut down on R&D trial expenses-ideal for lab exploration.
Parameters
|
Item |
Industrial Single-Chamber Model |
Industrial Multi-Chamber Model |
Research-Grade Model |
|
Applicable Wafer Size |
8 inch and below |
6 inch/ 8 inch |
8 inch and below |
|
Ultimate Vacuum |
8x10-5 Pa |
2x10-5 Pa |
- |
|
Film Uniformity |
≤±3% |
≤±3% |
±3%(4-inch target,8-inch wafer) |
|
Substrate Stage Temp.Control |
RT-650℃(or cooling) |
- |
RT-600℃(heating or cooling) |
|
Substrate Stage Rotation Speed |
- |
- |
5-20 RPM |
|
Sputtering Method |
Single-target sputtering |
- |
Single-target/ multi-target sequential/co-sputtering |
|
Power Supply |
Optional DC/RF/MF |
- |
Optional DC/RF/MF |
|
Key Configurations |
Single process chamber;≤4 target guns |
≤5 process chambers(heating, cooling, sputtering,etc.) |
Multi-target sputtering: pre-vacuum chamber(optional); |
|
Applicable Materials |
Silicon,compounds,ceramics,etc. |
Silicon,compounds,etc. |
Metals(Al,Au,Cu), dielectrics(SiO2,TaN), semiconductors |
FAQ
How to choose among the three models?
For mass production of 8-inch wafers (e.g., CMOS/IGBT), choose the industrial single-cavity model; for complex multilayer films in 5G/optoelectronics, choose the industrial multi-cavity model; for research and development of new materials in universities (e.g., silicon carbide), choose the research model.
Does it support non-silicon-based material coating?
Yes, it supports all, covering ceramics, compound semiconductors, metals (Al/Au), dielectrics (SiO₂), etc.
Can the wafer size be expanded?
Default is 8 inches and below (6-8 inches for the multi-cavity model). Small-scale expansion can be customized in advance, but process feasibility needs to be assessed.
What are the testing conditions for film thickness uniformity ≤ ±3%?
Based on 8-inch wafers (4-inch target + 8-inch wafer for the research model), standard metal/dielectric film layer testing. Optimization is possible for different materials/film thicknesses.
Is installation training provided?
We provide on-site installation and commissioning, plus operation/maintenance training to ensure the team can quickly get started.
Can the equipment be upgraded later?
Multi-cavity and research models can be upgraded with target guns/pre-vacuum chambers; single-cavity models have limited upgrade potential, so we recommend clearly defining long-term needs from the outset.
How long is the delivery cycle? Can it be expedited?
Single-cavity/research models: 8-12 weeks; multi-cavity models: 12-16 weeks; expedited delivery is negotiable and depends on production line scheduling.
Are there any discounts on post-production maintenance costs?
Mainly for target materials and consumables. Consumables are offered at a discount of ≥10% for 5 years after the warranty period. We also provide maintenance guidance to reduce costs.
Hot Tags: magnetron sputtering equipment, China magnetron sputtering equipment manufacturers, suppliers, magnetron sputtering machine, sputtering system, pvd equipment, dc magnetron sputtering system, magnetron sputtering system, sputtering device
