Product overview
Low-Temperature RTP Equipment: It offers exceptionally precise temperature control from 250℃ to 500℃, handling heat treatment of materials such as lithium niobate and silicon effectively.
It can process 150 8-inch wafers per batch, and can also handle 6-inch wafers. It effectively eliminates lattice defects, making it suitable for both research pilot projects and mass production.
The Low-Temperature RTP Equipment effective particulate contamination control significantly improves device performance, greatly contributing to stable production across the semiconductor industry chain.
Advantages
1.Medium and low temp control is super precise-cuts down on silicon wafer interface defects big time, and keeps process stability and uniformity rock solid.
2. The equipment runs reliably, totally meeting those strict precision needs for optoelectronic device fabrication.
3. Capacity design is spot-on, balancing R&D and mass production. Single-batch output is enough, so you can switch between production stages without swapping out equipment.
4. With efficient purification and steady temp control, we tackle particulate contamination at the source. It also boosts device insulation and light field modulation, laying a solid groundwork for high yield.
Applications
1.Semiconductor Device Manufacturing:
Works for making CMOS, IGBTs and other devices-zaps wafer interface lattice defects right in the 250℃-500℃ low temp range. Boosts material electrical properties, makes devices more reliable, ramps up mass production yield, and keeps batch performance consistent.
2. Optoelectronic Device Fabrication:
Fits VCSELs, photodetectors and similar products. Cuts down on particle interference during annealing, so silicon wafer interface quality stays solid. Also improves thin film density, optical field confinement and electrical insulation-plus it's compatible with lithium niobate and other materials, supporting integrated optical device production.
3. Research and Process Validation:
Perfect for universities and labs working on cutting-edge stuff like silicon carbide and quantum chips. Flexes easily between small-batch experiments and large-scale processing, with precise temp control keeping processes steady. Helps tweak process parameters and nail technological breakthroughs.
Parameters
|
Wafer size |
8inch(compatible with 6 inch) |
|
Temperature range |
250℃-500℃ |
|
Flat zone |
860mm |
|
Loading capacity |
150 wafers/batch |
|
Applicable Materials |
Lithium niobate,silicon,etc |
FAQ
What wafer sizes can this Low-Temperature RTP Equipment process?
It mainly handles 8-inch wafers, and 6-inch ones work too. Perfect for processing small and medium-sized semiconductors and optoelectronic devices.
How is the temperature control range and accuracy? Can it meet the requirements of low-temperature processes?
Temperature ranges from 250℃ to 500℃, and the control is super precise. The constant temperature zone is 860mm long, so it regulates the low-temperature range accurately-totally meets the low-temperature heat treatment needs of semiconductors and optoelectronic devices!
What is the maximum number of wafers that can be processed per batch? Can it be used for both research and mass production?
150 wafers per batch. That's enough for small-batch experiments in universities and labs, and it also keeps up with the efficiency needs of enterprise mass production-works for both sides.
What materials can it process? Is it compatible with commonly used optoelectronic devices?
It can process materials like lithium niobate and silicon. Great for making semiconductor devices such as CMOS and IGBTs, plus optoelectronic devices like VCSELs. Covers all mainstream material requirements.
What guarantees the stability of the process, such as particulate contamination control?
It has advanced particulate contamination control and efficient purification tech to cut down on particle interference during processing. Also, high-precision temperature control keeps processes like oxidation and annealing uniform and stable-no need to worry about product yield.
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