Product overview
This Advanced Packaging Wafer Plating equipment is all about flexibility and speed-it handles 6-inch to 12-inch wafers, and you can pick between 2D or 3D setups (that's BDS 2D and BDS 3D, respectively). It's built to fit right into advanced packaging and wafer-level processes, no matter your line's needs.
Inside, it's packed with components to keep throughput high: up to 3 load ports, 24 plating chambers (they work with Cu, Ni, Sn, Ag, Au-name the metal), 4 pre-wet chambers, and 4 SRD chambers. Everything you need for a smooth, uninterrupted workflow is right there.
What makes it reliable? Smart core designs-fountain-type plating cells keep contamination super low, and the module PM structure means less downtime for maintenance. Plus, specialized tech like tight seal control and cathode/anolyte separation? They lock in process stability, so every batch comes out consistent.
Advantages
Wide Wafer & Material Compatibility
Supports 6–12-inch wafers; plates multiple metals (Cu/Ni/Sn/Ag/Au) to cover diverse process needs.
High Scalability & Throughput
Configurable up to 24 plating chambers + 3 load ports, matching high-volume production demands.
Low Operational Cost & High Stability
Ultra-low chemical consumption + long-life seal technology (20000+ cycles) reduce running costs.
Fountain-type cells (no cross-contamination) and cathode/anolyte separation ensure plating solution stability.
High Uptime
Module PM design minimizes maintenance downtime, suitable for continuous mass production.
Advantages
Core Fields: Semiconductor advanced packaging, wafer-level packaging (WLP).
Key Processes: Pillar (pillar bump), Bump (solder bump), RDL (redistribution layer), TSV (through-silicon via) electroplating processes.
Parameters
|
Specification |
Details |
|
Wafer Size |
6-12 inch |
|
Configurations |
VMAX 2D, VMAX 3D |
|
Load Ports |
Maximum of 3 load ports |
|
Process Chambers |
-Up to 24 plating chambers(Cu, Ni, Sn/Ag, Au) |
|
Key Design Features |
-Fountain-type plating cell(no cross-contamination) |
|
Operational Advantages |
Ultra-low chemical consumption; high solution stability |
|
Target Applications |
Pillar,Bump,RDL,TSV(advanced/wafer-level packaging) |
FAQ
What wafer sizes does the BDS series support?
It's compatible with 6–12-inch wafers, covering both small and large formats for packaging processes.
What's the difference between BDS 2D and 3D?
They share core functions (plating for Pillar/Bump/TSV, etc.)-the 3D configuration is optimized for higher-throughput or more complex 3D packaging processes (e.g., advanced TSV).
Which metals can it plate?
It supports electroplating of Cu, Ni, Sn/Ag, and Au, matching diverse advanced packaging material needs.
How does it avoid cross-contamination?
It uses a fountain-type plating cell design, which prevents cross-contamination between different processes.
What's the service life of its seal components?
The specialized seal control technology ensures a seal life of over 20,000 cycles, reducing maintenance costs.
Can it handle high-volume production?
Yes-with up to 24 plating chambers and 3 load ports, it's designed for high-throughput continuous manufacturing.
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