Product overview
The Photoresist Stripping System is made just for 6–12-inch wafers-ideal for metal lift-off jobs across all sorts of fields. It comes ready to go with a 3-chamber setup (soaking, stripping, cleaning), but if you need more, we can customize multi-process cavities to match your workflow.
What makes it stand out? Useful features like NMP heating (ranging from room temp up to 90°C±2°C) and 30MPa high-pressure degumming-plus it recycles process liquid, which cuts down on waste. We didn't skimp on performance or safety either: ultrasonic stripping ensures fast, thorough metal removal, while the built-in CO₂ automatic fire extinguishing system keeps operations worry-free.
Advantages
Broad Wafer & Process Compatibility
Supports 6–12-inch wafers; adapts to lift-off processes for power devices, filters, MEMS, etc.
Efficient Stripping Performance
Combines NMP temperature control, 30MPa high-pressure degumming, and ultrasonic stripping for thorough metal removal.
Cost & Safety Optimization
Process liquid recycling (filtered reuse) reduces operational costs; CO₂ automatic fire extinguishing ensures safe operation.
Flexible Configuration
Standard 3-chamber setup + optional multi-process cavities, matching diverse production needs.
Applications
Core Fields: Power devices, filters, MEMS (micro-electromechanical systems), and other semiconductor-related fields.
Key Process: Metal lift-off (removing specific metal layers via wet processing) for device structure fabrication.
Parameters
|
Specification |
Details |
|
Wafer Size |
6-12 inch |
|
Standard Configuration |
3 chambers(soaking,stripping,cleaning) |
|
Optional Configuration |
Multiple process cavities(customizable) |
|
NMP Heating Parameters |
Room temperature~90℃±2℃ |
|
High-Pressure Degumming |
Maximum pressure:30MPa |
|
Key Functions |
- Process liquid recycling(filtered reuse) |
|
Safety System |
CO2 automatic fire extinguishing system |
|
Application Fields |
Power devices,filters,MEMS,etc. |
|
Core Process |
Metal lift-off(wet stripping of metal layers) |
FAQ
What wafer sizes does this equipment support?
It's compatible with 6–12-inch wafers, covering common formats in power devices, MEMS, etc.
What's the standard chamber setup?
The standard configuration includes 3 chambers: soaking, stripping, and cleaning (customizable multi-process cavities are also supported).
What temperature range does the NMP heating support?
It can heat NMP from room temperature up to 90°C ± 2°C, adapting to different stripping process needs.
How powerful is the high-pressure degumming function?
The maximum pressure of high-pressure degumming reaches 30MPa, ensuring thorough removal of residual materials.
Does it have cost-saving features?
Yes-the process liquid can be recycled and filtered for reuse, reducing operational costs.
What safety measures does it have?
It's equipped with a CO₂ automatic fire extinguishing system to ensure safe operation during processing.
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