Product overview
Single-Wafer Physical Scrubber Equipment is an automated single-wafer physical cleaning platform for semiconductor manufacturing. It delivers high-efficiency particle removal by physical scrubbing combined with chemical assistance.
This equipment is widely deployed for incoming wafer cleaning, post-CMP cleaning, post-marking cleaning, backside cleaning and photoresist residue removal. Featuring stable downflow inside chambers, it maintains excellent static and dynamic cleanliness environment. Multiple spray arms and fixed nozzles support mixed spraying modes. The gas-liquid separation structure separates organic solvent waste and DI-water discharge. Modular chamber configuration from 2-8 chambers is optional. It supports multi-size substrates including Si, SiC, Glass, GaAs, InP, Sapphire, LN and LT, covering R&D pilot as well as mass-volume production scenarios.
Advantages
Superb Particle Removal Capability
Achieves particle control ≤10ea@0.1 μm. Efficiently removes micro-particles, dust and surface residues through physical scrubbing, meeting strict cleanliness requirements for high-end semiconductor devices.
Reliable Chamber Environment Control
Stable vertical downflow suppresses particle re-adsorption on wafer surface. Gas-liquid separation mechanism prevents cross-mixing of different waste liquids, lowers pipeline corrosion risk and simplifies waste-water treatment.
Diversified Spraying Combination
Multiple spray arms together with fixed spray nozzles enable flexible spraying mode combinations. Physical scrubbing can coordinate with different chemical sprays to optimize cleaning performance for varied contamination types.
Modular and Scalable Layout
Optional 2-8 chamber configurations. Compact setups suit laboratory research and small-batch trials, while high-chamber-count configurations satisfy high-throughput mass-production demands.
Applications
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Advanced Packaging
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MEMS Devices
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Power Semiconductor Devices
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RF Integrated Circuits
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Semiconductor Optics
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Optical Communication Components
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Photomask Manufacturing
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University and Research Institute Laboratories
Parameters
|
Item |
Specification |
|
Process Function |
Incoming cleaning, post-CMP cleaning, post-marking cleaning, backside cleaning, photoresist residue cleaning |
|
Supported Substrates |
Si, SiC, Glass, GaAs, InP, Sapphire, LN, LT |
|
Chamber Configuration |
2-8 chambers (Optional) |
|
Particle Control |
≤10ea@0.1 μm |
|
Metal Ion Contamination |
5E9 atoms/cm² |
|
Core Design |
Stable downflow environment, gas-liquid separation structure, multi-mode spray system |
|
Processing Mode |
Single-wafer automatic physical scrubbing cleaning |
|
Dimension (2-4 chambers) |
2139 × 1986 × 2519 mm (W×D×H) |
|
Dimension (8 chambers) |
2400 × 3704 × 2950 mm (W×D×H) |
FAQ
Q: What cleaning tasks can this single wafer chemical cleaning equipment complete?
A: It handles substrate and epitaxial layer cleaning, photoresist stripping, oxide layer removal and other standard semiconductor wet clean workflows. It is widely used before and after lithography, etching and thin film deposition processes. Please provide your substrate material and contamination type for recipe tuning.
Q: What is the benefit of gas liquid separation mechanism?
A: It separates organic chemical waste and DI water drain streams. It avoids chemical cross mixing in waste pipeline, reduces pipeline corrosion and facilitates subsequent waste liquid treatment.
Q: What does the Auto Clean function do?
A: Auto Clean is an intelligent chamber self cleaning function. It supports high temperature SPM cleaning for chamber interior, reduces particle accumulation inside cavities and decreases PM maintenance frequency.
Q: Can the machine process different sizes of wafers?
A: Yes. The platform is designed for multi size wafer compatibility. Switching among qualified wafer sizes does not require large scale hardware modification.
Q: What is the difference between single wafer chemical cleaning and batch cleaning?
A: Single wafer cleaning treats each wafer independently with precise control over chemical dosage, temperature and process time. It achieves superior particle and metallic ion performance, which fits compound semiconductors, optical chips and high end devices with strict cleanliness requirements. Batch cleaning processes multiple wafers together and is more cost effective for large volume standard silicon wafer production.
Q: Can I choose a small chamber version for laboratory use?
A: Yes. Chamber quantity can be selected from 2 to 8. Low chamber count configurations are suitable for R&D and small batch trial production, while higher chamber count versions are targeted for mass production lines.
Q: What cleaning scenarios is the physical scrubber suitable for?
A: It is mainly used for incoming material cleaning, post CMP cleaning, post marking cleaning, wafer backside cleaning and residual photoresist removal. It focuses on physical removal of surface micro particles. Please provide substrate material and contamination information for recipe optimization.
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