Product overview
This Wafer Scrubber is a true workhorse-handles 6-inch to 12-inch wafers, and fits right into both wafer fabrication and advanced packaging workflows.
It's built to keep up with your production needs: 2–4 load ports and 4–8 cleaning chambers, so you can scale it up or down depending on volume. The best part? It does sequential front and back cleaning (thanks to the wafer flip function) plus has dedicated modules for backside and edge scrubbing-no spot gets missed.
Under the hood, it uses core cleaning tech that gets the job done right: hot DIW and N₂ atomizing two-fluid cleaning. Those features blast away particles and contaminants thoroughly, leaving wafers spotless. And with flexible configurations, it adapts seamlessly to whatever production scale you're running-no need for complicated adjustments.
Advantages
Wide Wafer Compatibility
Supports 6–12-inch wafers, covering mainstream formats in fabrication and packaging.
Comprehensive Cleaning Coverage
Sequential front/back cleaning (with flip function) + backside/edge scrubbing, eliminating dead zones in contamination removal.
Efficient & Thorough Cleaning
Hot DIW + N₂ atomizing two-fluid technology ensures high cleaning efficiency for particles and residues.
Scalable Configuration
2–4 load ports + 4–8 chambers, matching small-batch R&D or large-volume mass production needs.
Applications
Core Fields: Semiconductor wafer fabrication, advanced packaging.
Key Processes: Wafer surface particle/residue cleaning (including front/back/edge areas) during fabrication or packaging workflows.
Parameters
|
Specification |
Details |
|
Wafer Size |
6-12 inch |
|
Load Ports |
2-4 load ports |
|
Cleaning Chambers |
4-8 cleaning chambers |
|
Key Cleaning Functions |
- Wafer flip function(sequential front/back cleaning) |
|
Cleaning Technologies |
Hot DIW(Deionized Water), N2 atomizing two-fluid |
|
Application Fields |
Wafer fabrication, advanced packaging |
|
Core Purpose |
Wafer surface/backside/edge particle/residue removal |
FAQ
What wafer sizes can this scrubber clean?
It supports 6–12-inch wafers, covering mainstream formats in wafer fabrication and advanced packaging.
Can it clean both sides of the wafer?
Yes-with the wafer flip function, it can clean the front and back sides sequentially.
Does it clean the wafer edge too?
Absolutely-it's configured with a dedicated edge scrubber, plus backside scrubbing, for full-area coverage.
What cleaning technologies does it use?
It combines hot deionized water (hot DIW) and N₂ atomizing two-fluid cleaning for efficient particle/residue removal.
Can it adapt to different production scales?
Yes-configurable with 2–4 load ports and 4–8 chambers, it fits both small-batch R&D and large-volume production.
Which processes is it used for?
It's applied in wafer fabrication and advanced packaging, focusing on surface/backside/edge cleaning of wafers.
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