Product overview
Single-Wafer Chemical Cleaning Equipment is an automated single-wafer wet cleaning platform developed for semiconductor front-end and post-process cleaning requirements. It performs substrate and epitaxial layer cleaning, photoresist stripping, oxide removal and other critical cleaning procedures.
The machine adopts multi-spray arms plus fixed spray nozzles to realize diverse liquid spraying combinations. Stable downward airflow optimizes both static and dynamic chamber environment. The multi-cup structure achieves effective chemical separation, and the gas-liquid separation mechanism segregates organic waste liquid and DI-water discharge. Built-in intelligent Auto-Clean function supports high-temperature SPM process and lowers preventive maintenance frequency. The equipment supports multi-size wafer compatibility and covers substrates such as Si, SiC, LN, LT, Glass, GaAs, InP and Sapphire. Modular chamber options from 2-8 chambers meet demands ranging from laboratory R&D to high-volume mass manufacturing.
Advantages
Outstanding Cleaning Performance
Strict particle control ≤10ea@0.1μm, ultra-low metallic ion contamination down to 5E9 atoms/cm². Effectively removes particles, organic residues and metal impurities to guarantee subsequent-process yield.
Optimized Chamber Environmental Control
Stable vertical downflow inside chamber suppresses particle re-attachment. Multi-cup structure isolates different chemicals to prevent cross-contamination. Gas-liquid separation design separates organic waste and DI-water for safer waste disposal.
Flexible Multi-mode Spraying System
Equipped with up to three spray arms and one fixed nozzle. Multiple spraying patterns can be combined to adapt to various cleaning recipes for different substrates and contamination conditions.
Intelligent Self-maintenance Function
Integrated Auto-Clean function supports high-temperature SPM cleaning. It reduces manual cleaning workload and extends mean time between preventive maintenance.
Applications
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Advanced Packaging
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MEMS Devices
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Power Semiconductor Devices
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RF Integrated Circuits
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Semiconductor Optics
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Optical Communication Components
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Photomask Manufacturing
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University and Research Institute Laboratories
Parameters
|
Item |
Specification |
|
Model |
ACL Series |
|
Process Function |
Substrate & epitaxial layer cleaning, PR strip, oxide removal |
|
Supported Substrates |
Si, SiC, LN, LT, Glass, GaAs, InP, Sapphire |
|
Chamber Configuration |
2-8 chambers (Optional) |
|
Particle Control |
≤10ea@0.1 μm |
|
Metal Ion Contamination |
5E9 atoms/cm² |
|
Spray Unit |
Up to 3 spray arms + 1 fixed nozzle |
|
Key Feature |
Auto-Clean, supports high-temperature SPM process, gas-liquid separation |
|
Processing Mode |
Single-wafer automatic processing |
|
Dimension (2-4 chambers) |
2560 × 2426 × 2863 mm (W×D×H) |
|
Dimension (8 chambers) |
5252 × 2412 × 2959 mm (W×D×H) |
FAQ
FAQ
Q: What cleaning tasks can this single wafer chemical cleaning equipment complete?
A: It handles substrate and epitaxial layer cleaning, photoresist stripping, oxide layer removal and other standard semiconductor wet clean workflows. It is widely used before and after lithography, etching and thin film deposition processes. Please provide your substrate material and contamination type for recipe tuning.
Q: What is the benefit of gas liquid separation mechanism?
A: It separates organic chemical waste and DI water drain streams. It avoids chemical cross mixing in waste pipeline, reduces pipeline corrosion and facilitates subsequent waste liquid treatment.
Q: What does the Auto Clean function do?
A: Auto Clean is an intelligent chamber self cleaning function. It supports high temperature SPM cleaning for chamber interior, reduces particle accumulation inside cavities and decreases PM maintenance frequency.
Q: Can the machine process different sizes of wafers?
A: Yes. The platform is designed for multi size wafer compatibility. Switching among qualified wafer sizes does not require large scale hardware modification.
Q: What is the difference between single wafer chemical cleaning and batch cleaning?
A: Single wafer cleaning treats each wafer independently with precise control over chemical dosage, temperature and process time. It achieves superior particle and metallic ion performance, which fits compound semiconductors, optical chips and high end devices with strict cleanliness requirements. Batch cleaning processes multiple wafers together and is more cost effective for large volume standard silicon wafer production.
Q: Can I choose a small chamber version for laboratory use?
A: Yes. Chamber quantity can be selected from 2 to 8. Low chamber count configurations are suitable for R&D and small batch trial production, while higher chamber count versions are targeted for mass production lines.
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