Product overview
Single-Wafer Wet Etching Equipment is an automated single-wafer wet processing platform built for semiconductor wet etching applications. The system supports diverse etching processes for dielectric layers, metal films and compound semiconductor materials.
Featuring multi-spray arms and dedicated nozzles, the equipment delivers precise chemical dispensing onto individual wafers. It achieves excellent etching uniformity by independent flow, temperature and time control for each wafer. Multiple chamber options are available to satisfy R&D prototyping and high-volume manufacturing. The tool supports Nano spray, IPAN2 dry and other advanced drying technologies. It accommodates various wafer sizes and handles substrates such as Si, SiC, GaAs and InP. Optimized chamber design guarantees superior particle performance and cavity cleanliness.
Advantages
Superior Etching Uniformity
Independent single-wafer process control ensures dielectric etch uniformity＜5% and metal etch uniformity＜5%, delivering consistent process results across the whole wafer.
Outstanding Particle Performance
Optimized chamber airflow and liquid delivery design keep particle count below 10ea@0.2 μm, effectively reducing wafer defects and supporting high-yield production.
Multi-Process & Multi-Substrate Compatibility
Supports silicon-based and compound semiconductor substrates including Si, SiC, GaAs, InP. Capable of SiOx/SiNx dielectric etching and various metal etching processes. Multiple chemistries can run within one chamber with independent circulation and recovery. Up to 4 different chemicals are supported in the same chamber.
Modular & Scalable Chamber Design
Modular chamber configuration ranges from 2-8 chambers (optional). Customers can select compact setup for laboratory use or high-capacity configuration for mass production. Multi-size wafer compatibility reduces equipment investment for mixed-material projects.
Applications
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Advanced Packaging
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MEMS Devices
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Power Semiconductor Devices
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RF Integrated Circuits
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Semiconductor Optics
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Optical Communication Components
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Scientific Research & Institute Labs
Parameters
|
Item |
Specification |
|
Model |
AEH Series |
|
Process Function |
Dielectric Etching, Metal Etching (SiOx/SiNx, Cu, Ti, Au, Cr, Ni, ITO/IGZO etc.) |
|
Supported Substrates |
Si, SiC, GaAs, InP |
|
Chamber Configuration |
2-8 chambers (Optional) |
|
Dielectric Etch Uniformity |
＜5% |
|
Metal Etch Uniformity |
＜5% |
|
Particle Control |
＜10ea@0.2 μm |
|
Available Drying Technology |
Nano spray, IPAN2 dry |
|
Processing Mode |
Single-wafer automatic processing |
|
Chemical System |
Support up to 4 kinds of chemicals in one chamber with independent circulation recovery |
|
Dimension (3-chamber) |
2230 × 1980 × 2450 mm (W×D×H) |
|
Dimension (6-chamber) |
3040 × 1980 × 2760 mm (W×D×H) |
FAQ
FAQ
Q: What materials can this single wafer wet etching equipment etch?
A: It supports dielectric etching for SiOx, SiNx; metal etching for Cu, Ti, Au, Cr, Ni; and transparent conductive film etching for ITO, IGZO. It works on Si, SiC, GaAs, InP substrates. Please provide your target film and substrate for recipe development.
Q: What is the difference between single wafer wet etching and batch wet etching?
A: Single wafer tool processes wafers one by one. Each wafer has independent control over chemical volume, temperature and etch time for better within wafer uniformity. Batch tools process multiple wafers together. Single wafer equipment is more suitable for high precision, high yield compound semiconductor and advanced packaging projects.
Q: Can multiple chemicals be used inside one chamber?
A: Yes. The equipment supports up to 4 different chemistries within one chamber. Each chemical runs with independent circulation and recovery loop to avoid cross contamination.
Q: What drying technologies are available?
A: Nano spray and IPAN2 dry are optional. These advanced drying methods effectively reduce water mark defects, which is critical for compound semiconductor and optical device manufacturing.
Q: Can the equipment handle different wafer sizes?
A: Yes. The machine supports multi size wafer compatibility. No major hardware modification is required when switching between qualified wafer sizes.
Q: Is small quantity lab configuration available?
A: Yes. Chamber quantity is configurable from 2 to 8. Lower chamber count configurations fit for R&D, while high chamber count versions target mass production lines.
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