Product overview
The Horizontal Wafer Dryer is a fully automatic in-line bench laminar flow dryer - tailor-made for semiconductor manufacturing! It packs intelligent control, stable operation, and high-precision drying all in one. Designed to pair with cleaning machines or wafer etching equipment, it gets semiconductor substrates through "Dry in → Dry out" processing seamlessly.
Advantages
This Horizontal Wafer Dryer is a laminar flow dryer (in-line Bench fully automatic model) can be built in the cleaning machine or etch wafer machine, and can be customized according to customer needs. Through QDR or DIW (ultra-pure water cleaning) cleaning substrate chip, so that the cleaning equipment is dry in (Dry in) dry out (Dry out).
Advantages
PLC intelligent control makes all operation reliable and program intelligent.
Adopt variable frequency motor belt drive, low maintenance Turn shaft nitrogen seal, maze design, ensure that the equipment operation cavity isolation from the external environment.
The rotating mechanism is checked by precise dynamic balance, and the main frame adopts the bearing structure to ensure the balance and stability of the system, reduce the generation of vibration source, and greatly reduce the fragmentation rate.
The top adopts imported silicone heating auxiliary system, drying and dry without water.
Using electric heating system, fast heating, easy to control and stable temperature.
Parameters
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Basic Information |
Dimensions |
780mm (W) × 1510mm (D) × 1140mm (H) (Door Height: 1820mm) |
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Weight |
Approx. 450kg |
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Specification Parameters |
Voltage Requirement |
AC 380V, 3-phase, 50Hz/60Hz (40A) |
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Compressed Air (CDA) |
0.5MPa, 15L/min, 3/8" pipe fitting interface |
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Exhaust Parameter |
Max flow rate: 18-20m³/h, interface diameter: 110mm, supporting loose joint or hose connection |
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Drainage Parameter |
Max flow rate: 0.5m³/h, interface: DN32 PVC loose joint |
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Motor Configuration |
AC 380V / 3-phase / 5-wire / 3HP |
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Speed Control |
Inverter control; Standard working speed: 800RPM, Max speed: 999RPM; Speed upper limit can be set according to customer materials |
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Acceleration / Deceleration Time |
Acceleration: 25s from 0RPM to 600RPM; Deceleration: 40s from 600RPM to 0RPM (configurable) |
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Rotation Direction |
Clockwise (from top view) |
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Vibration Index |
At 350RPM, P-P displacement of X, Y, Z axes is ≤90μm |
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Timer |
Configurable via Human-Machine Interface (Touch Screen) |
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Equipment Surface Treatment |
Sheet Metal Spraying Process |
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Performance Indicators |
Load-Bearing Capacity |
Capable of carrying 2 pcs of 6-inch "full-cover" cassettes / 2 pcs of 4-inch "full-cover" cassettes and wafers (cassettes provided by customer) |
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Applicable Materials |
Various semiconductor materials with thickness ≥300μm (inclusive) |
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Fragmentation Rate |
≤1/10,000 (inclusive); Note: Fragmentation caused by unexpected accidents or failures due to machine components is included in this indicator; Fragmentation caused by product defects is not included |
|
|
Basic Information |
Equipment Dimensions |
780mm (W) × 1510mm (D) × 1140mm (H) (Door Height: 1820mm) |
|
Equipment Weight |
Approx. 450kg |
|
|
Specification Parameters |
Voltage Requirement |
AC 380V, 3-phase, 50Hz/60Hz (40A) |
|
Compressed Air (CDA) |
0.5MPa, 15L/min, 3/8" pipe fitting interface |
|
|
Exhaust Parameter |
Max flow rate: 18-20m³/h, interface diameter: 110mm, supporting loose joint or hose connection |
|
|
Drainage Parameter |
Max flow rate: 0.5m³/h, interface: DN32 PVC loose joint |
|
|
Motor Configuration |
AC 380V / 3-phase / 5-wire / 3HP |
|
|
Speed Control |
Inverter control; Standard working speed: 800RPM, Max speed: 999RPM; Speed upper limit can be set according to customer materials |
|
|
Acceleration / Deceleration Time |
Acceleration: 25s from 0RPM to 600RPM; Deceleration: 40s from 600RPM to 0RPM (configurable) |
FAQ
1.What materials is this Horizontal Wafer Dryer suitable for?
It is specialized for drying various semiconductor materials with a thickness of ≥300μm (inclusive), compatible with 6-inch and 4-inch "full-cover" cassettes (cassettes provided by the customer).
2.What are the core performance advantages?
Key advantages include a fragmentation rate as low as ≤1/10,000, PLC intelligent control, nitrogen shaft seal (maze design) for environmental isolation, and fast, stable electric heating with no dripping after drying.
3.Can it be integrated with existing production lines?
Yes, it is a fully automatic in-line Bench model that can be built into cleaning machines or wafer etching equipment, supporting "Dry in → Dry out" process integration.
4. Is the operation user-friendly?
Equipped with HMI (touch screen) and 5m cables, it allows easy setting of timer, speed limit and other parameters; the cylinder-driven door cover enables convenient operation.
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