Wafer Inspection Microscope

Wafer Inspection Microscope

Thermal shock test chamber is used to test the resistance ability of specimen in extreme high and low temperature cycling environment, which is test the chemical change or physical damage due to heat expansion and cold contraction in short period.
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Description

Product overview

 

 Our Wafer Inspection Microscope an intelligent optical inspection system designed for semiconductor wafers, display panels, solar cells, and other precision industrial applications.Combining high-quality optical imaging, motorized motion control, autofocus technology, and advanced image analysis functions, the system provides accurate and efficient inspection solutions for microscopic defect detection, measurement, and analysis.Equipped with high-performance microscope optics and flexible inspection modules, Miracle Inspection enables users to observe, measure, locate, and mark defects at the micro level. It supports multiple observation modes including bright field, dark field, polarization, fluorescence, and DIC, making it suitable for various material and process inspection requirements.

 

Advantages

 

High-Resolution Optical Imaging

The system uses professional microscope optics to provide clear and detailed images for precise inspection and analysis.

Autofocus and Motorized Control

The autofocus module and motorized XYZ stage help users quickly locate inspection areas and maintain stable focus during operation.

Multiple Inspection Modes

Supports bright field, dark field, polarization, fluorescence, and DIC observation modes to meet different inspection requirements.

Defect Marking Function

With an optional laser marking module, detected defects can be physically marked on samples for further analysis and process improvement.

Image Stitching and Depth of Field Fusion

Advanced image processing functions allow multiple images to be combined into large-area or fully focused images, improving inspection efficiency.

Flexible and Easy Operation

The integrated workflow combines imaging, measurement, analysis, and reporting functions, reducing manual operation steps and improving inspection consistency.

 

 

Application

 

Semiconductor Wafer Inspection

  • Surface defect inspection of semiconductor wafers
  • Detection of particles, scratches, cracks, and abnormal patterns
  • Wafer process monitoring after lithography, etching, deposition, and CMP
  • Failure analysis and defect review

Display Panel Inspection

  • Inspection of glass substrates and panel materials
  • Micro defect detection and quality control
  • Pattern and surface analysis

Solar Cell Inspection

  • Surface inspection of solar wafers
  • Micro crack and defect identification
  • Process quality evaluation

Research and Laboratory Analysis

  • Material analysis
  • Microstructure observation
  • Sample measurement and documentation

 

 

Specifications

 

ItemSpecification
Inspection TypeOptical microscope inspection system
ApplicationSemiconductor wafer, display panel, solar cell, precision materials
Wafer Compatibility4-inch / 6-inch / 8-inch wafer (optional)
Optical SystemZEISS microscope optical system
Observation ModesBright field, dark field, DIC, polarization, fluorescence (optional)
AutofocusSupported
Motion StageMotorized XYZ stage
XY Accuracy≤ 2 μm
Z-axis Fine Adjustment Accuracy≤ 1 μm
ImagingCompatible with ZEISS Axiocam series and third-party cameras
Measurement FunctionsLength, angle, diameter, and geometric measurement
Image ProcessingImage stitching, depth of field fusion, image analysis
Defect MarkingLaser defect marking module (optional)
Wafer HandlingAutomatic loading and unloading module (optional)

 

 

 

 

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