Product overview
The Automatic RTP Equipment compatible with 8-12 inch wafers, featuring single/dual-cavity designs, and specifically designed for mass production. Integrating robots and other components, it achieves fully automated wafer loading, annealing, and cooling. It can interface with production management systems and supports different processes for a single wafer cask. With precise temperature control and stable operation (wafer breakage rate ≤1/10000), it includes multiple safety protections and is suitable for high-precision annealing processes in semiconductor and other fields.
Features
We've got equipment options covering different widths and chamber counts, all delivering consistent performance across key parameters.
It works with both Open cassette and SMIF setups, handling the entire process automatically-from Mapping and Alignment to Wafer Transfer, Annealing, and Cooling.
The software lets you pick preset recipes tailored to individual wafers in the same cassette, while keeping you updated with real-time processing status.
This fully automated system integrates seamlessly with your existing EAP/MES infrastructure for smoother workflow coordination.
During installation and debugging, our after-sales engineers will be on-site to provide hands-on support and address any issues that come up.
Advantages
- Utilizing dual infrared halogen lamps for heating, coupled with rapid nitrogen cooling, the system boasts efficient and stable thermal circulation.
- A dedicated lamp grouping design ensures more uniform temperature throughout the processing area.
- A built-in PID control algorithm allows for real-time adjustment of lamp power, maintaining precise temperature control throughout the process.
- Three-level user access management ensures convenient and secure information control. The main software interface displays key parameters such as gas flow rate, temperature, and vacuum level in real time, providing a clear overview of the status.
- The system automatically saves all process-related data for easy future traceability.
- It features a comprehensive anomaly protection mechanism that immediately triggers protection upon detecting a fault, including overheating (water-cooled aluminum alloy chamber ≥70℃), abnormal thermocouple readings, abnormal heating power, unlocked furnace door, excessive gas pressure, insufficient water flow, and water leakage.
- An emergency stop function can be triggered with a single button, immediately interrupting all processes and cutting off the heat source.
Parameters
|
Model |
RTP-200 |
RTP-300 |
|
Wafer Size |
8 inch and below 12 inch and below |
8 inch and below 12 inch and below |
|
Chamber Number |
1 |
2 |
|
Load Cassette Number |
2 |
2 or 3 |
|
Load Cassette Method |
SMIF or Open Cassette |
|
|
Size |
1600mm×2450mm×2200mm (W×D×H) |
2100mm×2450mm×2200mm (W×D×H) |
|
Temperature Range |
R.T.~~800℃(Controlled by thermocople) 500℃~1250℃(Controlled by pyrometer) |
R.T.~~800℃(Controlled by thermocople) 500℃~1250℃(Controlled by pyrometer) |
|
Max Heating Rate |
150℃/s---Wafer only 20℃/s---SiC carrier 30℃/s---Graphite carrier coating SiC |
150℃/s---Wafer only 20℃/s---SiC carrier 30℃/s---Graphite carrier coating SiC |
|
Temperature uniformity |
≤±3℃ @ ≤600℃ ≤±0.5% @ ＞600℃ |
≤±3℃ @ ≤600℃ ≤±0.5% @ ＞600℃ |
|
Temperature Repeatability |
±1℃ |
±1℃ |
|
Number of Lamps/SCRs |
33 ea / 10 set |
45 ea / 16 set 55 ea / 24 set |
|
Max MFC |
6 |
6 |
|
Lowest Pressure |
30mTorr |
30mTorr |
|
Leak Rate |
10mTorr/min |
10mTorr/min |
|
O2 Percentage |
＜1 ppm |
＜1 ppm |
|
Automatic |
OCR+Robot(Dual Arm)+Fingers(Vacuum/Bernoulli)+Aligner+Cooling Station |
|
|
WPH(Prediction) |
5 |
|
|
Uptime |
＞92% |
|
|
Mean Time To Clean (MTTC) |
≤6hours |
|
|
Mean Time To Repair (MTTR) |
≤4hours |
|
|
Mean Time Between Failures (MTBF) |
≥200hours |
|
|
Mean Wafers Between Breakage (MWBB) |
≤1 in 10,000 wafers |
|
|
Max/ Avg Power |
90/ 60 Kw(ATS-8) 100/ 80 Kw(ATS-12) |
180/ 120 Kw(DTS-8) 200/ 160 Kw(DTS-12) |
|
Voltage |
380V/ 60HZ/ 3 Phase 5 Wires |
380V/ 60HZ/ 3 Phase 5 Wires |
|
Control Method |
PC Control |
PC Control |
FAQ
Is Automatic RTP Equipment compatible with 8/12-inch wafers? Does scaling up to 12-inch production require equipment replacement?
Fully compatible. Scaling up only requires software parameter adjustments; no equipment replacement is needed, reducing costs.
Can it integrate with existing EAP/MES systems? Will it affect the production line?
Seamless integration is possible. Engineers will provide on-site debugging, improving production line efficiency and consistency.
Can different processes be set for the same wafer cask? Is the operation complicated?
Supports "multiple processes per cask." The software interface allows for easy selection and settings, requiring no additional training.
Is there safety protection in case of emergencies? Will it damage wafers or injure personnel?
It has emergency stop and automatic risk detection protection to safeguard both wafers and personnel.
Certification
◆ Certification of Compliance SEMI S2
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