Product overview
Our company's vertical and horizontal tube thermal furnaces both center on high-precision temperature control-they handle all key semiconductor heat treatments, like oxidation, diffusion, and annealing-whether it's for mass production or lab R&D. The real differences between them come down to structure and how they fit specific uses:
Vertical tube thermal furnace
Vertical Tube Furnace saves space, fits ≤8-inch wafers (12-inch industrial option available). Key specs: 850mm max constant temperature zone, ±0.5℃ control accuracy.
Industrial model: Boosts IC/IGBT mass production via nonstop batch processing. Research model: Caters to SiC/quantum chip medium-low temperature needs for small-batch verification.
Horizontal tube thermal furnace
Horizontal Tube Furnace design, flexible 1-4 tube config; 300-1000mm customizable constant temperature zone, 400℃-1200℃ range.
Industrial model: Multi-process integration for wafer doping/structural forming. Research model: Blends teaching & development, ideal for university small-batch experiments.
Both use clean chambers and stable temperature control, covering semiconductor thermal needs from R&D to mass production.
Applications
- For universities/research institutions: Supports small-batch R&D of SiC, quantum chips, etc., aiding new material process verification and performance testing.
- Micro-nano processing: Handles diffusion, oxidation, annealing, LPCVD-serves as a flexible platform for optoelectronic/photonic device research.
- Optical device R&D: Fits integrated optical waveguide/high-speed photonic device development; matches LiNbO₃ heat treatment needs in proton exchange.
- University teaching: Assists experimental teaching/process development, helping master semiconductor thermal equipment and connect theory with engineering.
Advantages
High-precision temperature control:
±0.5℃ accuracy; even at 1100℃, single-point stability stays ±0.5℃ for 24h, ensuring reliable data repeatability.
Multi-process compatibility:
Vertical furnaces support diffusion/oxidation; horizontal ones add annealing & LPCVD. Both fit SiC/quantum chip R&D.
Research-friendly adaptability:
Works with ≤8-inch wafers (1-4 tubes optional). Single-tube small-batch design cuts costs; supports long continuous runs for experiments.
Parameters
|
Item |
Vertical Tube Furnace |
Horizontal Tube Furnace |
|
Temperature Range |
200℃-600℃,600℃-1200℃(two ranges optional) |
200℃-600℃,600℃-1200℃(two ranges optional) |
|
Temperature Control Accuracy |
≤±0.5℃ |
≤±0.5℃ |
|
Temperature Uniformity |
- |
≤±1℃ |
|
Single-point Temperature Stability |
≤±0.5℃@1100℃ for 24 consecutive hours |
≤±0.5℃@1100℃ for 24 consecutive hours |
|
Maximum Heating Rate |
10℃/min |
10℃/min |
|
Length of Constant Temperature Zone |
200-500mm |
200-500mm |
FAQ
What wafer sizes does the tube thermal furnace handle?
Both vertical and horizontal models support wafers up to 8 inches.
What core processes can they perform?
Vertical Tube Furnace: Covers diffusion, oxidation, and annealing.
Horizontal Tube Furnace: Adds LPCVD integration on top of those basics.
Can the number of process tubes be customized?
Absolutely-you can pick 1 to 4 tubes per unit, based on your needs.
How precise is the temperature control?
Temperature control accuracy stays within ±0.5℃. Even at 1100℃, a single point maintains stability within ±0.5℃ for 24 straight hours. For horizontal furnaces, temperature uniformity is within ±1℃ too.
What about heating rate and temperature range?
Max heating rate hits 10℃/min, with two temperature ranges available: 200-600℃ and 600-1200℃.
Is the constant temperature zone length adjustable?
It ranges from 200-500mm by default, and customization is supported.
Which is better for university research labs?
Go for vertical if you need basic processes-it saves space and is cost-effective. Pick horizontal if you need LPCVD, teaching support, or to bridge lab work and mass production.
Can it run long experiments? Is maintenance costly?
It supports nonstop long-term operation. Maintenance is infrequent, so costs stay manageable.
Is it suitable for pilot or small-batch production?
Yes-both models switch smoothly between R&D and small-batch production.
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