Product overview
The SE Series Cu-Ti Etching Integrated Equipment is all about specialized wet etching for semiconductor advanced packaging-designed to handle 8–12-inch wafers seamlessly. It's a fully customizable metal etching solution, so you can tweak it to fit your setup: choose anywhere from 2 to 8 chambers, and it works with 2–4 SMIF POD or FOUP carriers.
Under the hood, it's got integrated chemical management (with CCSS/LCSS support) and rock-solid process controls-think precise heating, concentration adjustments, and flow/pressure regulation. Safety isn't an afterthought either: overheating protection and leak detection come standard, so you can run operations with confidence. Plus, full SECS/GEM communication means it slots right into your existing workflows.
At the end of the day, this system is built for one key job: efficient Cu-Ti metal layer etching that keeps advanced packaging processes running smooth and reliable.
Advantages
1.Format & Configuration Flexibility
Supports 8–12-inch wafers; 2–8 chambers (customizable) to match production scale.
Adapts to 2–4 SMIF POD/FOUP carriers, fitting legacy/modern fab logistics.
2.Targeted Metal Etching Capability
Specialized for Cu/Ti metal layer etching, with optional chemistries (etchant, SC1+Megasonic, etc.) for process customization.
3.Efficient & Cost-Effective
Integrates chemical reclaim and classified exhaust (acid/base/organics) to reduce material waste and operational costs.
Precise process control ensures uniform etching quality across batches.
4.Safety & Integration
Built-in overheating protection, leak detection, and classified drainage for safe operation.
Full SECS/GEM support enables seamless connection to fab MES systems.
Applications
Core Field: Semiconductor advanced packaging.
Key Process: Wet etching of Cu (copper) and Ti (titanium) metal layers in advanced packaging workflows (for metal layer patterning, supporting packaging structure fabrication).
Parameters
|
Specification |
Details |
|
Wafer Size |
8-12 inch |
|
Chambers |
2-8 chambers(supporting customization) |
|
Carrier Compatibility |
2-4 SMIF POD/FOUP |
|
Supported Chemistries |
Etchant,SC1+Megasonic,DHF,DICO2,N2(configurable) |
|
Chemical Supply Support |
CCSS, LCSS |
|
Process Control Features |
Heating control, concentration control, flow rate control, |
|
Exhaust Management |
Separated exhaust for acid, base and organics |
|
Additional Features |
Chemical reclaim; Bath overheating protection; Leakage |
|
Communication Protocol |
SECS/GEM |
|
Target Application Field |
Advanced packaging |
FAQ
Q: What wafer sizes does this equipment support?
A: It's compatible with 8–12-inch wafers, covering common formats in advanced packaging.
Q: Can the number of chambers be adjusted?
A: Yes-chamber quantity is customizable (2–8 chambers) to match your production scale.
Q: What carriers does it work with?
A: It supports 2–4 SMIF POD/FOUP carriers, adapting to both legacy and modern fab logistics systems.
Q: What materials can it etch?
A: It's specialized for wet etching of Cu (copper) and Ti (titanium) metal layers in advanced packaging.
Q: Does it have cost-saving features?
A: Yes-integrated chemical reclaim and classified exhaust help reduce material waste and operational costs.
Q: Can it connect to our factory's MES?
A: Absolutely-it fully supports the SECS/GEM communication protocol for seamless MES integration.
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