Product overview
The SCD8 is fully-automatic 8-inch spin coater & developer track for semiconductor lithography processes. Built on modular design philosophy, it supports multiple chamber combinations and can be fitted with an Interface module for inline connection with lithography systems. The equipment handles Si, Glass, SiC and other substrates, catering to high-volume production as well as R&D for power devices, MEMS, RF integrated circuits and advanced packaging. It delivers stable performance for i-line, KrF, ArF, PI, SOG, SOC lithography workflows.
Advantages
Dual-size compatibility without hardware replacement Switch between different wafer sizes without swapping mechanical parts, reducing product change-over time and operation cost.
Inline connection available for lithography tools Optional Interface module enables inline docking with mainstream lithography exposure machines to realize fully-automated track-litho workflow.
Rich optional functional modules Supports high-precision hot plate, optical alignment, WEE wafer edge exposure and other add-ons to satisfy diversified process requirements.
Factory-automation ready Software supports both local operation and remote fab automation control, adapting to smart-factory management demands.
Broad substrate compatibility Supports silicon, glass, silicon carbide (SiC), well-suited for wide-bandgap semiconductor manufacturing.
Parameters
|
Item |
Specification |
|
Model |
SCD8 8-inch Spin Coater & Developer |
|
Wafer Size |
8-inch (200 mm), dual-size compatible without part replacement |
|
Substrate Material |
Si, Glass, SiC |
|
Chamber Configurations |
2C2D / 4C / 4D / 4C4D (customizable) |
|
Supported Lithography Process |
i-line, KrF, ArF, PI, SOG, SOC |
|
Warped Wafer Compatibility |
Support warpage ≤5 mm ultra-thin / warped wafer transfer & processing |
|
Dimension (W × D × H) |
4053 × 1750 × 2460 mm |
|
Inline Function |
Optional Interface module for lithography machine inline docking |
|
Optional Units |
High-precision hot plate, optical alignment, WEE wafer edge exposure module |
|
Control Mode |
Local control / remote factory automation control |
|
Certification |
Compliant with SEMI S2 |
Faqs
Q: What substrates and wafer sizes does SCD8 support?
A: Mainly designed for 8 inch(200 mm) wafers. Supported substrates include Si, Glass, SiC. It supports dual size switching without part replacement, and can process warped / ultra thin wafers with warpage ≤5 mm.
Q: What lithography processes are compatible with SCD8?
A: It supports i line, KrF, ArF, PI, SOG, SOC lithography processes, covering IC, wide bandgap semiconductor and MEMS process needs.
Q: Can SCD8 connect inline with lithography scanners / steppers?
A: Yes. Equipped with the optional Interface module, it can realize inline docking with mainstream lithography exposure machines.
Q: What chamber configurations can I choose?
A: Available configurations: 2C2D / 4C / 4D / 4C4D. Optional add ons: high precision hot plate, optical alignment, WEE, Interface inline module.
Q: Who is the target user for SCD8?
A: 8 inch semiconductor fabs, power device manufacturers, MEMS / RF enterprises, and university & research institute labs.
Q: Can SCD8 be used for both mass production and R&D?
A: Yes. Flexible modular configurations satisfy high volume mass production lines, and also fit small batch experimental R&D scenarios.
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