Product overview
Spray Coater Equipment is an automatic spray photoresist coating system designed for wafers with deep-hole patterns, high-aspect-ratio steps, round and square substrates.
Adopting ultrasonic atomization photoresist spraying technology, the equipment achieves uniform photoresist coverage on step surfaces, edges, sidewalls and bottom of deep structures. The system can be configured with integrated coating chambers and developing chambers to fulfill linked coating-developing workflows. It delivers flat-spray uniformity and excellent step coverage performance for TSV deep hole and high-aspect-ratio structure applications. Multiple chamber options are available to meet the requirements of scientific research trial-run and mass-production manufacturing.
Advantages
Superior Coating Performance for Complex Topography
Ultrasonic atomization spray technology enables consistent photoresist coverage on steep sidewalls, deep hole bottoms and wafer edges. Solves poor coverage issues faced by traditional spin coater on high-aspect-ratio features.
Excellent Process Indicators
Flat-spray uniformity reaches 5%@5-10 μm, and step coverage ≥30%. Stable coating quality supports subsequent lithography and etching processes.
Flexible Chamber Expandability
Supports 2-4 chambers with optional Coater (COT) and Developer (DEV) modules. Integrated coating-developing configuration simplifies process flow for different production needs.
Modular Customization for Different Scenarios
Compact configuration for laboratory R&D and pilot testing; expanded multi-chamber setup for high-throughput mass production.
Applications
-
Advanced Packaging (TSV Deep Hole Process)
-
MEMS Devices
-
Power Semiconductor Devices
-
RF Integrated Circuits
-
Semiconductor Optics
-
Optical Communication Components
-
University and Research Institute Laboratories
Parameters
|
Item |
Specification |
|
Model |
ASP Series |
|
Process Function |
Photoresist spray coating; optional developing function (COT / DEV module) |
|
Supported Substrates |
Si, Glass, round & square patterned substrates |
|
Chamber Configuration |
2-4 chambers (COT, DEV optional) |
|
Flat-spray Uniformity |
5% @5-10 μm |
|
Step Coverage |
≥30% |
|
Key Technology |
Ultrasonic atomization photoresist spraying |
|
Processing Mode |
Automatic spray coating |
|
Overall Dimension |
2665 × 2825 × 2550 mm (W×D×H) |
FAQ
Q: What is the core advantage of spray coater compared with traditional spin coater?
A: Spin coater mainly suits flat wafer surfaces. Spray coater applies ultrasonic atomized photoresist, realizing effective coverage on deep holes, sidewalls and high aspect ratio steps. It is ideal for TSV and MEMS devices with complex surface topography.
Q: Can this machine complete both coating and developing in one unit?
A: Yes. The system supports optional COT (coating) and DEV (developing) chambers. Customers can select standalone spray coater or combined coater developer configuration according to process flow.
Q: Does it support square substrates besides round wafers?
A: Yes. The spray coating mechanism is compatible with both round wafers and square substrates such as glass pieces, which cannot be well processed by spin coating. Please provide substrate dimension for recipe assessment.
Q: What step coverage performance can I expect?
A: Under optimized recipes, step coverage ≥30%. Real world results are subject to actual feature depth, aspect ratio and photoresist type. We offer process tuning support.
Q: Is small batch lab configuration available?
A: Yes. Chamber quantity can be configured from 2 4 chambers. Compact versions are suitable for R&D trial, while multi chamber setup serves mass production lines.
Q: Which photoresist types are compatible with the ASP spray coater?
A: It adapts to most standard semiconductor photoresists. Please share your photoresist model and viscosity for feasibility verification before project implementation.
Hot Tags: spray coater equipment, China spray coater equipment manufacturers, suppliers, Coater System, Coating and Developing System, Developer System, lithography machine, Maskless aligner i line Lithography System, Maskless Lithography Machine
