Product overview
Nice-Tech' 8-inch IBD system is specialized for low-temperature, high-density, and high-uniformity thin-film deposition on 8-inch wafers. It uses sputtering technology with a dual-ion-source setup (sputtering + assist source): the main source generates deposition particles, while the assist source enables in-situ pre-cleaning and film densification.
Equipped with a 4-slot rotating target drum (supports up to 4 target materials) and a real-time optical control system (monitors/ adjusts film spectra), it optionally integrates ion beam etching (IBE) for "deposition-etching" in one chamber. Compliant with semiconductor standards, it fits 8-inch mass production and R&D.
Advantages
Low-Temp, High-Density Films
Creates high-quality, dense films at low temperatures and ultra-low pressure. This avoids wafer damage entirely and directly boosts long-term device durability.
Multi-Material Versatility
Equipped with a 4-slot target drum, it supports both single and composite films-covering metals, alloys, oxides, and more-no frequent target swaps needed.
Integrated Precision Control
Opt for IBE to get "pre-clean → deposition → etching" all in one chamber. Real-time monitoring ensures consistent film performance across every batch.
Wide Compatibility
Customized for 8-inch wafers. Uses standard components, making maintenance a breeze and integration with existing production lines seamless.
Applications
Hard disk components: Deposits key films (e.g., hard magnetic bias layers) for HDD read heads (TMR/AMR), ensuring magnetic stability.
Optical devices: Prepares Bragg Stacks and other optical films for lasers, photodetectors, and optical sensors.
Precision sensors: Deposits functional films (magnetic, conductive) for MEMS/magnetic sensors, enhancing sensitivity.0
R&D: Supports novel film (2D composites, piezoelectric films) development in universities and research institutes.
Parameters
|
Category |
8-inch IBD System |
|
Wafer Compatibility |
8-inch (primary); adaptable to partial special-size substrates via process adjustment |
|
Ion Source Configuration |
Dual-ion-source (sputtering ion source + auxiliary ion source); optional IBE (Ion Beam Etching) function |
|
Target Drum Capacity |
4-slot rotating target drum (supports up to 4 different target materials) |
|
Deposition Temperature |
Low-temperature process (avoids thermal damage to wafer and sensitive devices) |
|
Process Pressure |
Ultra-low pressure environment (contributes to high-density film deposition) |
|
Film Control System |
Real-time optical control system (monitors, analyzes and adjusts film spectrum in real time) |
|
Depositable Materials |
Metals, alloys, oxides, and customizable for novel functional films (e.g., 2D composites, piezoelectric films) |
|
Process Integration |
"Pre-cleaning-deposition-etching" integrated process (optional, same chamber) |
|
Industry Compliance |
Compliant with semiconductor industry processing standards |
|
Key Components |
International standard parts (low maintenance cost, convenient spare parts replacement) |
FAQ
Q: What wafer size does the system primarily support?
A: 8-inch (adaptable to partial special-size substrates).
Q: How many target materials can it handle?
A: Up to 4, via a 4-slot rotating target drum.
Q: Does it integrate etching functionality?
A: Yes, optional IBE (Ion Beam Etching) for "deposition-etching" in one chamber.
Q: What's the key deposition advantage?
A: Low-temperature, high-density films with real-time optical control for consistency.
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