1. Lead Frame Type (traditional wire frame form), represented by manufacturers such as Fujitsu, Hitachi Rohm, Goldstar and others.
2. Rigid Interposer Type, represented by manufacturers such as Motorola, Sony, Toshiba, Panasonic, etc.
3. Flexible Interposer Type, the most famous of which is Tessera's microBGA, and CTS's sim BGA also uses the same principle. Other representative manufacturers include General Electric (GE) and NEC.
4. Wafer Level Package: Unlike traditional single chip packaging methods, WLCSP cuts the entire wafer into individual chips, and it is known as the future mainstream of packaging technology. Manufacturers that have invested in research and development include FCT, Aptos, Casio EPIC, Fujitsu, Mitsubishi Electronics, etc.
CSP packaging has the following characteristics:
1. It meets the increasing demand for I/O pins in chips.
The ratio between chip area and packaging area is very small.
3. Greatly shorten the delay time.
CSP packaging is suitable for ICs with fewer pins, such as memory modules and portable electronic products. In the future, it will be widely applied in emerging products such as information appliances (IA), digital TVs (DTV), e-books (E-Books), wireless networks WLAN/Gigabit Ethernet, ADSL/mobile phone chips, Bluetooth, etc.
