Product overview
Developed by Nice-Tech, the MSE 100 is a 12-inch integrated system tailored specifically for special metal stack etching-its core purpose is to support the manufacturing scenarios of emerging memory devices.
The standout feature of this system lies in its integration capability: it combines Reactive Ion Etching (RIE), Ion Beam Shaping (IBS), and in-situ passivation processes into a single unit. And the main reason for this design is to meet the processing requirements of several types of complex metal stacks-think Magnetic Tunnel Junctions (MTJs) in Magnetic Random Access Memory (MRAM), alloy phase change layers in Phase Change RAM (PCRAM), and resistive stacks in Resistive RAM (ReRAM). These are all key focus areas in the industry right now.
This kind of metal stack tends to produce non-volatile byproducts, making patterning extremely challenging-that's a persistent pain point for the industry. The LMEC-300™ addresses this issue perfectly. By adopting an integrated process design within a vacuum environment, it circumvents the limitations of traditional single-process approaches. Frankly speaking, it delivers a pretty stable and reliable solution for the key manufacturing processes of emerging memory devices.
Advantages
Integrated Vacuum Process
It's all about combining etching, dry cleaning, and in-situ passivation-this way, we can stop sidewall metal from oxidizing, and that directly gives device reliability a nice boost.
Dual-Technology Synergy
When RIE and IBS work together, good things happen. The RIE sidewall contamination? Gone. The line width limits that used to hold IBS back? Broken through. It's a real win-win for performance.
Flexible Adaptation
This system's pretty versatile-it handles MRAM, PCRAM, ReRAM, and even sensors with no fuss. And if you add the optional hardmask chamber? You've got an all-in-one etching solution that works for nodes ≤55nm too.
Mass-Production Ready
It checks the box for 12-inch wafer standards, which is crucial. For large-scale production lines, that means performance stays stable and consistent-no unpleasant surprises when you scale up.
Applications
Emerging memory manufacturing
Etching MTJs (MRAM), PCRAM phase change layers, and ReRAM resistive stacks .
Special metal stack processing
Etching non-volatile metal/alloy stacks with complex compositions .
12-inch IC back-end processes
Supporting advanced nodes requiring high-precision metal etching and integrated hardmask handling .
Parameters
|
Category |
Details |
|
Wafer Compatibility |
12-inch (300mm) wafers; adaptable to large-size wafer integrated processing for semiconductor mass production |
|
Chamber Configuration |
3 core chambers: Chimera N RIE chamber, Pangea A IBS chamber, Basalt A in-situ deposition chamber; optional Chimera A hardmask opening chamber |
|
Process Environment |
Full-vacuum-enclosed operation; avoids ambient exposure to prevent sidewall metal oxidation and hydration |
|
Target Materials |
Complex special metal stacks (MRAM MTJs, PCRAM phase change layers, ReRAM metal-oxide-metal resistive stacks) |
|
Technology Nodes |
Compatible with advanced nodes down to 55nm; meets high-precision patterning needs |
|
Key Process Capabilities |
1. One-stop processing (plasma etching, dry cleaning, in-situ passivation); 2. RIE-IBS synergy for contamination and line width solutions; 3. Optional hardmask-to-functional layer integrated etching |
|
Industrial Compliance |
Adopts 12-inch IC production line standard components; complies with SEMI design standards; passes strict stability tests |
FAQ
Q: What wafer size does the MSE 100 support?
A: Supports 12-inch (300mm) wafers for semiconductor mass production.
Q: Which devices is it suitable for?
A: Ideal for emerging memory devices (MRAM, PCRAM, ReRAM) and special metal stack processing.
Q: What core processes does it integrate?
A: Combines RIE, IBS, and in-situ passivation; optional hardmask etching for all-in-one solutions.
Q: What technology nodes is it compatible with?
A: Supports advanced nodes down to 55nm.
Q: Does it meet industrial production standards?
A: Yes, complies with SEMI standards and uses 12-inch fab standard components.
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