Product overview
Nice-Tech offers two mass-production metal etching systems for different wafer sizes, both based on ICP technology and tailored for IC back-end (BEOL) metal processing.
12-Inch System MES 12
Focuses on sub-0.18μm high-density Al interconnects in 12-inch IC BEOL. It includes ICP etch chambers, descum chambers, and a transfer module, and also supports Al pad etching.
8-Inch Systems MES 8
Two models available-MES 800 (≤8% within-wafer/≤5% wafer-to-wafer uniformity, 8,000pcs/month for 4μm Al) and MES 800P (≤5% within-wafer/≤3% wafer-to-wafer uniformity, 20,000pcs/month for 0.1μm Al, 400 RF-h MTBC)
Advantages
High Precision & Stability
12-inch system fits sub-0.18μm processes; 8-inch M2 offers better uniformity and longer stable operation (400 RF-h MTBC).
Capacity & Cost Efficiency
12-inch system serves high-end large-scale lines; 8-inch models provide flexible capacity (8,000–20,000pcs/month) with space-saving design.
Broad Compatibility
12-inch system covers Al interconnects/pads; 8-inch systems support W recess, and Kessel Pishow M is compatible with 6-inch wafers via optional ESC .
Applications
IC BEOL Metal Interconnects
12-inch system for sub-0.18μm 12-inch Al interconnects/pads; 8-inch systems for 8-inch Al processing (M2 for 0.1μm nodes).
Multi-Size/Process Processing
8-inch MES 800 fits 6-inch wafers; both 8-inch models support W recess.
Capacity Upgrade
12-inch system aids large fabs' high-end capacity expansion; 8-inch models (M for mid-small lines, M2 for high-efficiency scaling).
Parameters
|
Category |
12-Inch Metal Etching System (MES 12) |
8-Inch Metal Etching System (MES 800) |
8-Inch Metal Etching System (MES 800P) |
|
Wafer Compatibility |
12-inch (300mm) IC wafers; tailored for sub-0.18μm technology nodes |
8-inch IC wafers; compatible with 6-inch wafers via optional ESC |
8-inch IC wafers; optimized for 0.1μm technology nodes |
|
Chamber Configuration |
ICP etch chambers + descum chambers + transfer module |
ICP etch chambers + transfer module |
ICP etch chambers + transfer module |
|
Key Process Capabilities |
High-density Al interconnect etching, Al pad etching (BEOL processes) |
Al interconnect etching, Al pad etching, W Recess |
High-precision Al interconnect etching, Al pad etching, W Recess |
|
Etch Uniformity |
Industry-leading uniformity control for sub-0.18μm high-density processes |
≤8% within-wafer; ≤5% wafer-to-wafer |
≤5% within-wafer; ≤3% wafer-to-wafer |
|
Monthly Capacity |
Optimized for high-end 12-inch IC BEOL mass production (matching large fab throughput) |
Up to 8,000 pieces/month (for 4μm-thick Al etching) |
Up to 20,000 pieces/month (for 0.1μm-node Al interconnect etching) |
|
MTBC |
Meets 12-inch IC mass-production stability standards |
Aligns with 8-inch fab basic stability requirements |
Up to 400 RF-h (enhanced stability for high-throughput production) |
|
Industrial Compliance |
Conforms to semiconductor mass-production standards for 12-inch IC BEOL lines |
Fits 8-inch IC fab space and cost demands; compatible with mainstream BEOL workflows |
Designed for high-efficiency 8-inch IC mass production; meets advanced node stability and yield requirements |
FAQ
Q: What wafer sizes do the systems support?
A: 12-inch system: 12-inch (300mm) IC wafers; 8-inch systems: 8-inch IC wafers (MES 800 compatible with 6-inch via optional ESC).
Q: What core processes do they cover?
A: All support Al interconnect/pad etching; 8-inch models add W Recess compatibility.
Q: What's the monthly capacity of 8-inch models?
A: MES 800: 8,000pcs (4μm Al); MES 800P: 20,000pcs (0.1μm Al).
Q: What's the MTBC of MES 800P?
A: Up to 400 RF-h for enhanced high-throughput stability.
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