Product overview
Nice-Tech offers two dedicated silicon etching systems for different wafer sizes, both based on ICP technology and tailored for IC mass production.
12-Inch System (SES-12)
Focuses on 12-inch IC front-end (FEOL) processes. Composed of ICP etch chambers and a transfer module, it covers silicon etch, dielectric etch, gate etch, W recess, and SADP, designed for high-precision patterning of logic and memory devices.
8-Inch System (SES-8)
A multi-chamber system for 8-inch fabs, centered on gate processes. It ensures ≤5% within-wafer and wafer-to-wafer etch uniformity, excellent particle control, and supports AA, STI, spacer, and W recess.
Advantages
Wide Process Coverage
We've got two main setups here. The 12-inch system takes on all sorts of FEOL processes, no problem. As for the 8-inch one? It's focused on gate and related processes, and it fits perfectly with nodes 0.11μm and above.
High Precision & Stability
Precision is where these systems shine. The 12-inch model delivers top-tier uniformity and etch selectivity-exactly what advanced processes demand. The 8-inch version holds its own too: low uniformity deviation, plus strict particle control, so you can count on consistent results.
Mass-Production & Cost-Efficiency
Best of all, both are ready for mass production. The 12-inch is built for large-scale production lines, which makes sense for high-volume runs. The 8-inch, though, is a smart pick if you're upgrading capacity-it saves on both space and cost, which is always a plus for operations.
Application
IC FEOL Manufacturing
12-inch system for 12-inch logic/memory FEOL processes; 8-inch system for 8-inch gate etching.
Advanced Processes
12-inch system supports SADP/W recess; 8-inch system works for STI/spacer processes.
Capacity Upgrade
12-inch integrates into large fabs; 8-inch provides cost-effective support for mid-small fabs.
Parameters
|
Category |
12-Inch Silicon Etching System |
8-Inch Silicon Etching System |
|
Wafer Compatibility |
12-inch (300mm) IC wafers, customized for mass-production lines |
8-inch IC wafers; compatible with 0.11μm and advanced technology nodes |
|
Chamber Configuration |
ICP etch chambers + transfer module |
ICP etch chambers + transfer module; multi-chamber design for mass production |
|
Key Process Capabilities |
Silicon etch, dielectric etch, gate etch, W recess, SADP |
Gate etch, AA, STI, spacer etch, W recess |
|
Etch Uniformity |
Superior uniformity control (meets advanced node precision standards) |
≤5% within-wafer; ≤5% wafer-to-wafer |
|
Particle Control |
Strict particle control for high product yield |
Excellent particle control for stable mass production |
|
Industrial Compliance |
Suitable for 12-inch IC volume production; conforms to semiconductor mass-production standards |
Independent optimized design; fits 8-inch fab space and cost demands for capacity upgrade |
FAQ
Q: What wafer sizes do the two systems support?
A: The 12-inch system supports 12-inch (300mm) IC wafers, and the 8-inch system supports 8-inch IC wafers.
Q: What core processes do they cover?
A: The 12-inch system covers silicon etch, dielectric etch, SADP, W recess, etc.; the 8-inch system focuses on gate etch and supports STI, spacer etch, etc.
Q: Which technology nodes are they compatible with?
A: The 12-inch system adapts to advanced technology nodes; the 8-inch system is compatible with 0.11μm and above advanced nodes.
Q: Are both systems suitable for mass production?
A: Yes. The 12-inch system fits large-scale production lines, while the 8-inch system is space-saving and cost-effective for mass production.
Q: What is the etch uniformity of the 8-inch system?
A: It has ≤5% within-wafer uniformity and ≤5% wafer-to-wafer uniformity.
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