Characteristics and advantages of various semiconductor packaging forms:
DIP dual in-line package
DIP (Dual In Line Package) refers to integrated circuit chips that are packaged in a dual in line format. The vast majority of small and medium-sized integrated circuits (ICs) use this packaging format, and the number of pins generally does not exceed 100. The CPU chip packaged in DIP has two rows of pins that need to be inserted into a chip socket with DIP structure. Of course, it can also be directly plugged into a circuit board with the same number of solder holes and geometric arrangement for soldering. Special care should be taken when inserting and unplugging DIP packaged chips from the chip socket to avoid damaging the pins.
DIP packaging has the following characteristics:
1. Suitable for punching and soldering on PCB (printed circuit board), easy to operate.
The ratio between chip area and packaging area is relatively large, resulting in a larger volume.
The 8088 in Intel series CPUs adopts this packaging form, as do cache and early memory chips.
BGA ball grid array packaging
With the development of integrated circuit technology, the packaging requirements for integrated circuits are becoming more stringent. This is because packaging technology is related to the functionality of the product. When the frequency of the IC exceeds 100MHz, traditional packaging methods may produce the so-called "CrossTalk" phenomenon. Moreover, when the number of pins on the IC is greater than 208, traditional packaging methods have their own difficulties. Therefore, in addition to using QFP packaging, most high pin count chips today (such as graphics chips and chipsets) have switched to BGA (Ball Grid Array Package) packaging technology. BGA has become the best choice for high-density, high-performance, and multi pin packaging of CPUs, south/north bridge chips on motherboards, and other devices since its emergence.
BGA packaging technology can be divided into five categories: 1. PBGA (Plasric BGA) substrate: generally a multi-layer board composed of 2-4 layers of organic materials. In the Intel series CPUs, the Pentium II, III, and IV processors all use this packaging form.
2. CBGA (Ceramic BGA) substrate: refers to a ceramic substrate, and the electrical connection between chips and substrates is usually installed using a flip chip (FC) installation method. In the Intel series CPUs, Pentium I, II, and Pentium Pro processors have all adopted this packaging form.
3. FCBGA (FilpChipBGA) substrate: hard multi-layer substrate.
4. TBGA (TapeBGA) substrate: The substrate is a 1-2 layer PCB circuit board with strip like soft material.
5. CDPBGA (Carity Down PBGA) substrate: refers to the chip area (also known as the cavity area) with a square shaped depression in the center of the package.
BGA packaging has the following characteristics:
Although the number of I/O pins has increased, the distance between pins is much greater than that of QFP packaging, which improves the yield.
Although the power consumption of BGA increases, the use of controllable collapse chip soldering can improve the electrical and thermal performance.
3. The signal transmission delay is small, and the adaptation frequency is greatly improved.
4. Assembly can be carried out using coplanar welding, greatly improving reliability.
The BGA packaging method has entered the practical stage after more than ten years of development. In 1987, Citizen Corporation in Japan began developing chips with plastic encapsulated ball grid array packaging (BGA). Subsequently, companies such as Motorola and Compaq also joined the development of BGA. In 1993, Motorola was the first to apply BGA to mobile phones. In the same year, Compaq also applied it to workstations and PC computers. Until five or six years ago, Intel began using BGA in computer CPUs (such as Pentium II, Pentium III, Pentium IV, etc.) and chipsets (such as i850), which played a role in expanding the application field of BGA. BGA has become an extremely popular IC packaging technology, with a global market size of 1.2 billion pieces in 2000. It is expected that the market demand will increase by more than 70% in 2005 compared to 2000.
