The semiconductor production process consists of wafer manufacturing, wafer testing, chip packaging, and post packaging testing. After encapsulation, a series of operations need to be carried out, such as post mold cure, trimming and forming, plating, and printing. The typical packaging process is as follows: slicing, mounting, bonding, plastic sealing, trimming, electroplating, printing, cutting, and forming. Appearance inspection, finished product testing, packaging, and shipment.
