The wafer manufacturing process of common 200mm CMOS chips.
Chemical vapor deposition is a technique used in the manufacture of microelectronic devices to deposit a thin film, which may be a dielectric material or a semiconductor. Physical vapor deposition technology uses inert gases to impact sputtering targets and deposit the desired material on the surface of the wafer. The high temperature and vacuum environment inside the process reaction chamber can cause these metal atoms to form grains, which can then be patterned and etched to obtain the desired conductive circuit.
Optical development is the process of converting graphics from a photomask onto a thin film. Optical development generally includes steps such as photoresist coating, baking, light alignment, exposure, and development. Dry etching is the most commonly used etching method, which uses gas as the main etching medium and plasma to drive the reaction. Etching is the removal of an unwanted material from a surface.
Chemical Mechanical Polishing (CMP) is a technology that combines both mechanical polishing and acid-base solution based chemical polishing, which can make the wafer surface relatively flat and facilitate subsequent processes. During grinding, the grinding slurry is between the wafer and the grinding pad. The factors that affect CMP include the pressure of the grinding head and wafer flatness, rotation speed, chemical composition of the grinding slurry, and so on.
