A wafer refers to a silicon chip used in the production of silicon semiconductor circuits, and its raw material is silicon. After dissolving high-purity polycrystalline silicon, silicon crystal seeds are added and slowly pulled out to form cylindrical monocrystalline silicon. After grinding, polishing, and slicing, silicon crystal rods form silicon wafers, also known as wafers. Domestic wafer production lines are mainly 8-inch and 12 inch.
The main processing methods for wafers are wafer processing and batch processing, which means processing one or more wafers simultaneously. With the decreasing size of semiconductor features and the advancement of processing and measurement equipment, new data characteristics have emerged in wafer processing. At the same time, the reduction in feature size increases the impact of the number of particles in the air on the quality and reliability of the processed wafer during wafer processing. With the improvement of cleanliness, new data characteristics have also emerged in the number of particles.
